Spoked Mounting Frame High Speed Connector Crosstalk Control

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Solution Overview

Problem

High-speed connectors face challenges in reducing crosstalk while maintaining signal integrity and impedance control, particularly as terminal sizes are minimized, leading to issues with shield usage and impedance discontinuities.

Innovation Solution

The use of larger ground shield terminals positioned adjacent to differential signal terminals, arranged in a serpentine path within the connector frame, along with a spoked structure that supports terminals and maintains air spacing, to control crosstalk and impedance through edge and broadside coupling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If shields are positioned between adjacent sets of differential signal terminals to reduce crosstalk, then crosstalk is reduced, but the connector size and cost increase significantly

Engineering Contradiction:
ImprovecrosstalkVSAvoidconnector size
Core Design Contradiction:
Object-affected harmful factorsVSVolume of stationary object

Solution Approach 1:

The patent divides the traditional large shield into multiple smaller ground terminals that are distributed between differential signal terminals. Each ground terminal is individually sized and positioned to provide localized shielding, replacing the single large shield structure with segmented smaller elements that collectively achieve the same crosstalk reduction function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies different ground terminal sizes at different locations within the connector. Ground terminals are made larger than signal terminals in specific positions where crosstalk protection is most needed, while maintaining smaller overall dimensions compared to traditional shields. This localized variation in ground terminal size optimizes crosstalk reduction without uniformly increasing connector volume.

Inventive Principle:
Principle #3Local quality

2Object-affected harmful factors

If shields are positioned between adjacent sets of differential signal terminals to reduce crosstalk, then crosstalk is reduced, but manufacturing cost increases significantly

Engineering Contradiction:
ImprovecrosstalkVSAvoidmanufacturing cost
Core Design Contradiction:
Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent segments the shield function into multiple smaller ground terminals that can be manufactured using standard terminal forming processes. This segmentation allows ground terminals to be produced using existing manufacturing equipment and techniques, avoiding the need for expensive custom shield fabrication and assembly operations.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the dimensional parameters of ground terminals relative to signal terminals, making ground terminals larger in specific dimensions to provide effective crosstalk protection. This parameter variation is achieved through standard terminal forming processes, allowing cost-effective manufacturing while maintaining the required electrical performance for crosstalk reduction.

Inventive Principle:
Principle #35Parameter changes

3Volume of stationary object

If ground terminals are made the same size as signal terminals to eliminate shields, then connector size is reduced, but system impedance increases due to coupling issues

Engineering Contradiction:
Improveconnector sizeVSAvoidimpedance control
Core Design Contradiction:
Volume of stationary objectVSReliability

Solution Approach 1:

The patent implements local quality variation by making ground terminals larger than signal terminals in specific dimensions and positions. This size differentiation creates optimal coupling characteristics between ground and signal terminals, maintaining controlled impedance levels while still achieving compact connector dimensions. The larger ground terminals provide sufficient reference plane area to prevent impedance degradation.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the dimensional parameters of ground terminals relative to signal terminals, specifically increasing ground terminal size in areas that affect impedance control. This parameter adjustment optimizes the electrical coupling between ground and signal terminals, maintaining desired impedance levels without requiring shield-sized dimensions, thus resolving the contradiction between compact size and impedance control.

Inventive Principle:
Principle #35Parameter changes

4Volume of stationary object

If terminals are spaced closer together to reduce connector size, then connector size is reduced, but crosstalk increases due to electrical field interference

Engineering Contradiction:
Improveconnector sizeVSAvoidcrosstalk
Core Design Contradiction:
Volume of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality enhancement by positioning larger ground terminals adjacent to closely spaced differential signal terminals. These enlarged ground terminals create stronger electrical reference planes at critical locations where crosstalk is most likely to occur, providing localized field containment that enables closer terminal spacing without excessive crosstalk.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the dimensional parameters of ground terminals to be larger than signal terminals, creating a size differential that provides enhanced electrical shielding. This parameter change increases the effective ground reference area near signal terminals, reducing electrical field interference and enabling closer terminal spacing while maintaining acceptable crosstalk levels.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively reduces crosstalk and maintains desired impedance levels, achieving low insertion loss and maintaining signal integrity at high data transfer rates, as demonstrated by electrical field intensity plots and insertion loss measurements.

Implementation Method 1

Adding more connector housing support material, such as plastic, may reduce the amount of air to be used as a dielectric, which may promote an impedance discontinuity

Methodology Applied
Scientific EffectAir dielectric: Dielectric

Implementation Method 2

signal interference occurs between closely spaced signal terminals especially between pairs of adjacent differential signal terminals. This is referred to in the art as 'crosstalk' and it occurs when the electrical fields of signal terminals abut each other and intermix

Methodology Applied
Scientific EffectElectromagnetic field coupling: Electric Field

Data Source

PatentUS7878853B2High speed connector with spoked mounting frame
Publication Date: 2011.02.01 MOLEX INC
  • US7878853B2 patent drawing
  • US7878853B2 patent drawing
  • US7878853B2 patent drawing

AI summary

A high speed connector with reduced crosstalk utilizes individual connector support frames that are assembled together to form a block of connector units. Each such unit supports a column of conductive terminals in two spaced-apart columns. The columns have differential signal terminal pairs separated from each other by larger intervening ground shields that serve as ground terminals. The ground shields are arranged in alternating fashion within the pair of columns and they are closely spaced together so as to face a differential signal terminal pair. The support frames support the ground and signal terminals utilizing radial spokes in which the spokes take the form of ribs that extend along the inner surfaces of one of the connector halves and define V-shaped air channels.