Sponge-Like Brush Compression for Substrate End Surface Cleaning
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Solution Overview
Problem
Existing substrate cleaning technologies face challenges in effectively removing deposits from the peripheral portions, particularly the end surfaces, of substrates during the cleaning process, leading to potential contamination and adverse effects on device miniaturization.
Innovation Solution
A substrate cleaning apparatus and method utilizing a sponge-like brush with a compressing mechanism to increase the brush's hardness and cleaning force, featuring a cylindrical shape with a small-diameter and large-diameter part, and a brush-shape deforming member to optimize cleaning by varying compressive force and shape deformation for effective deposit removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a sponge-like brush is brought into contact with the peripheral portion of the substrate to remove deposits, then the cleaning coverage is improved, but the cleaning force is insufficient to remove firmly adhering deposits from the end surface
Solution Approach 1:
The brush compressing mechanism dynamically adjusts the brush's physical state by applying compression force during the cleaning process. This transforms the brush from a soft, compliant state (good for coverage) to a compressed, hardened state (good for cleaning force), allowing the same brush to effectively address both cleaning coverage and cleaning force requirements at different stages or conditions of operation
Solution Approach 2:
The invention changes the physical parameter of the brush (hardness/compression state) by applying mechanical compression. This parameter change enables the brush to generate sufficient cleaning force against firmly adhering deposits on the end surface while maintaining the sponge-like material's ability to conform to the substrate surface for comprehensive coverage
2Reliability
If the brush is compressed to increase cleaning force, then the cleaning effectiveness is improved, but the brush shape deformation may reduce cleaning precision
Solution Approach 1:
The system dynamically controls the compression state of the brush, allowing it to be compressed when cleaning effectiveness is prioritized and relaxed when precision is needed. This dynamic adjustment enables the system to adapt between effectiveness and precision requirements during different phases of the cleaning process
Solution Approach 2:
The brush is designed with varying local properties through its compression structure, where different regions of the brush can be compressed to different degrees. This allows the compressed portions to provide enhanced cleaning effectiveness for stubborn deposits while uncompressed portions maintain the precision needed for delicate areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively removes deposits from substrate end surfaces and peripheral portions by enhancing the cleaning force through brush compression and shape deformation, ensuring thorough cleaning and minimizing re-deposition, thus addressing the limitations of previous technologies.
Implementation Method 1
a brush compressing mechanism configured to compress the brush; wherein the brush cleans at least the end surface of the substrate, under a state in which the brush is compressed and hardened by the brush compressing mechanism
Implementation Method 2
a substrate rotating mechanism configured to rotate the substrate held by the substrate holding mechanism
Implementation Method 3
a cleaning-liquid supply mechanism configured to supply a cleaning liquid to the substrate held by the substrate holding mechanism
Data Source
AI summary
To provide a substrate cleaning apparatus capable of effectively removing deposits adhering to at least an end surface of a substrate by means of a sponge-like brush. A substrate cleaning apparatus includes: a spin chuck configured to rotatably hold a substrate W; a motor configured to rotate the substrate W held by the spin chuck; a cleaning-liquid supply mechanism configured to supply a cleaning liquid to the substrate W held by the spin chuck. The cleaning mechanism includes: a brush made of a sponge-like resin, which is brought into contact with at least an end surface of the wafer W during the cleaning; and a brush compressing mechanism configured to compress the brush. The brush is compressed by the compressing mechanism, and cleans at least the end surface of the substrate W.