Spot-Faced Aperture for Underfill Dispensing

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Solution Overview

Problem

The semiconductor industry faces challenges in packaging semiconductor devices due to the need for smaller, more integrated electronic components, which requires efficient methods for forming electrical connections and underfill material application that minimize space and maximize manufacturing efficiency.

Innovation Solution

The use of package substrates with spot-faced apertures, featuring a wider tank region and narrower pin-hole region, allows for efficient underfill material dispensing and curing, providing a stronger capillary effect for faster injection and spreading, and minimizing required bump and routing areas, thereby improving packaging efficiency and protecting integrated circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional underfill material dispensing methods are used, then material application is achieved, but the process requires multiple passes and more space, reducing manufacturing efficiency

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidtime for underfill application

Core Design Contradiction:

ProductivityVSLoss of time

Solution Approach 1:

The aperture is segmented into two distinct regions: a tank region for material storage and a pin-hole region for controlled dispensing. This segmentation allows the underfill material to be stored and then injected through a narrow opening, enabling one-pass application and improving manufacturing efficiency while reducing the space required compared to conventional dispensing methods.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The aperture structure acts as an intermediary between the underfill material and the gap between the substrate and semiconductor device. The tank region receives and holds the material, while the pin-hole region controls its flow into the gap, enabling precise one-pass application without requiring additional dispensing passes or excessive space.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If larger aperture openings are used for underfill material dispensing, then material flow is improved, but the required bump and routing areas increase, reducing packaging efficiency

Engineering Contradiction:

Improvepackaging efficiencyVSAvoidbump and routing area

Core Design Contradiction:

ProductivityVSArea of stationary object

Solution Approach 1:

The aperture is divided into a tank region with a first opening and a pin-hole region with a second opening. The pin-hole region has a narrower opening than the tank region, allowing the aperture to provide sufficient material flow through the narrow second opening while the wider first opening minimizes the overall area required for bump and routing structures, thereby improving packaging efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the aperture have different opening sizes optimized for their specific functions: the tank region has a wider opening for material storage and access, while the pin-hole region has a narrower opening for precise dispensing. This local differentiation allows efficient material flow through a compact structure, reducing the total area required for bump and routing.

Inventive Principle:

Principle #3Local quality

3Speed

If spot-faced apertures with narrow pin-hole regions are used, then capillary effect is enhanced for faster injection, but manufacturing precision requirements increase

Engineering Contradiction:

Improveinjection and spreading speedVSAvoidaperture formation precision

Core Design Contradiction:

SpeedVSManufacturing precision

Solution Approach 1:

The aperture is segmented into a tank region and a pin-hole region, where the pin-hole region provides the narrow opening necessary for strong capillary effect and fast injection. The tank region with its wider opening compensates for the precision requirements by providing a larger target area for aperture formation, thus maintaining manufacturing feasibility while achieving high injection speed.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The aperture structure changes the physical parameters of material delivery by creating a narrow pin-hole region that enhances capillary pressure. This parameter change (narrow opening) increases the capillary effect to accelerate injection and spreading speed, while the overall aperture design maintains manufacturability by providing a larger tank region that is easier to form with standard precision.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables one-pass underfill material application, reducing time and costs, increasing units per hour, and enhancing manufacturing efficiency while providing improved protection for integrated circuits, particularly in flip-chip ball grid array packaging schemes with ultra-thin integrated circuits.

Implementation Method 1

providing a stronger capillary effect for faster injection and spreading

Methodology Applied

Scientific EffectCapillary effect: Capillary Action

Data Source

PatentUS10128208B2Package substrates, packaged semiconductor devices, and methods of packaging semiconductor devices

Publication Date: 2018.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In some embodiments, a package substrate for a semiconductor device includes a substrate core and a material layer disposed over the substrate core. The package substrate includes a spot-faced aperture disposed in the substrate core and the material layer.