Solution Attachment Device for SPR Sensor Metal Films
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Solution Overview
Problem
Existing solution attachment methods for surface plasmon resonance sensor devices face challenges in accurately covering small metal film areas with a solution, leading to uneven distribution and reduced coverage due to the size and wettability issues of the ejection tool and substrate, as well as the proximity of multiple metal films.
Innovation Solution
A solution attachment device and method that utilize an ejection tool with a controlled ejection opening and projection regions to align and precisely attach a solution to a substrate, adjusting the distance between the ejection tool and the metal films to ensure complete coverage without mixing solutions between adjacent films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the amount of solution to be ejected is increased to cover the small metal film area, then the coverage of the metal film is improved, but the solutions attached to adjacent metal films mix together and the attachment range control accuracy deteriorates
Solution Approach 1:
The ejection tool bottom surface is divided into multiple ejection openings, each corresponding to a specific metal film. This segmentation allows independent solution ejection for each metal film, preventing solution mixing between adjacent films while ensuring complete coverage of each individual film area.
Solution Approach 2:
The ejection tool is designed with localized ejection openings at specific positions and orientations. Each ejection opening is positioned to eject solution in a direction substantially parallel to the substrate surface, creating localized solution attachment zones that precisely match the metal film areas without affecting adjacent regions.
2Manufacturing precision
If the ejection tool bottom surface area is smaller than the metal film area, then the attachment precision is improved, but the solution runs round to the side surface and adheres to it causing incomplete coverage
Solution Approach 1:
The solution ejection direction is changed from vertical (perpendicular to substrate) to horizontal (parallel to substrate). This dimensional change in ejection direction allows the solution to spread across the metal film surface without running down the side surfaces of the ejection tool, achieving complete coverage while maintaining precision.
3Productivity
If multiple metal films are arranged close to each other to increase detection capacity, then the productivity is improved, but the solutions from adjacent ejection openings mix together reducing measurement accuracy
Solution Approach 1:
The ejection tool is segmented with multiple independently positioned ejection openings, each aligned with a specific metal film. This segmentation enables simultaneous solution attachment to multiple adjacent metal films without cross-contamination, maintaining measurement precision while increasing detection capacity.
Solution Approach 2:
The ejection openings act as intermediaries that control solution flow paths. By positioning and orienting each ejection opening to eject solution parallel to the substrate surface, the system creates distinct solution paths for adjacent metal films, preventing mixing while enabling high-density film arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for highly accurate control of solution attachment, preventing solution from adhering to the ejection tool sides and ensuring uniform coverage of the metal films, even with non-uniform wettability, thereby enhancing the detection sensitivity in surface plasmon resonance measurements.
Implementation Method 1
an ejection tool 131 having an ejection opening 131A that ejects a solution J1 in a direction of gravitational force
Implementation Method 2
there is a likelihood that, during the ejection of the solution, the solution that has been ejected between the bottom surface of the ejection tool and the metal films may run round to a side surface of the ejection tool and may be attached to the side surface
Data Source
AI summary
A solution attachment device includes: an ejection tool having an ejection opening that ejects a solution in a direction of gravitational force; and a solution attachment control portion for controlling attachment of the solution ejected from the ejection opening to at least one attachment subject region of the solution formed on a substrate in a state in which the at least one attachment subject region is disposed below an end surface including the ejection opening of the ejection tool in the direction of gravitational force, and, in the state, a first projection region obtained by projecting the end surface to a surface perpendicular to the direction of gravitational force substantially overlaps a second projection region obtained by projecting the at least one attachment subject region to the surface.