Spray Cooling Cover for Direct Chip Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current fluid cooling devices for electronic components, such as central processing units, suffer from reduced cooling efficiency due to the separation between the component and the working fluid by a metal cover, which hampers effective heat dissipation and operational performance.
Innovation Solution
A fluid cooling device comprising a bottom plate, an adhesive layer, and a spray cooling cover with a fluid jet array and buffer cavities that allows a two-phase working fluid to directly contact the chip surface, enhancing heat dissipation by utilizing a fluid inlet, outlets, and nozzles to spray the fluid onto the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal cover (IHS) is used to protect the central processing unit and separate it from the working fluid, then the electronic component is protected, but the cooling efficiency is reduced
Solution Approach 1:
The patent removes the metal cover (IHS) that was separating the working fluid from the chip surface. By extracting this protective barrier, the working fluid can directly contact the chip surface, eliminating the thermal resistance layer and significantly improving cooling efficiency while maintaining component protection through alternative means
Solution Approach 2:
The patent changes the physical state and contact parameters of the working fluid by transitioning from indirect cooling (through metal cover) to direct cooling (direct contact with chip surface). This parameter change in the cooling mechanism enables much more effective heat transfer from the chip surface
2Temperature
If a cold plate contacts the metal cover to cool the electronic component, then heat dissipation is achieved, but the heat dissipation efficiency is reduced due to the separation by metal cover
Solution Approach 1:
The patent extracts and removes the metal cover from the cooling path, allowing the working fluid to directly contact the chip surface. This elimination of the intermediate metal barrier removes the thermal resistance that was limiting heat dissipation efficiency, enabling much more effective heat transfer while maintaining component protection
Solution Approach 2:
The patent eliminates the metal cover as an intermediary between the working fluid and the chip. By removing this mediating layer with poor thermal conductivity, the system achieves direct thermal contact between the working fluid and heat source, dramatically improving heat dissipation efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency, effectively controlling the working temperature of electronic components and enhancing their operational performance by directly spraying the working fluid onto the chip surface.
Implementation Method 1
a working fluid flows into the cold plate through the pipeline, and the cold plate contacts the surface of the metal cover of the electronic component such as the central processing unit to take away the heat generated by the operating electronic component
Implementation Method 2
the working fluid is a two-phase working fluid
Implementation Method 3
the adhesive layer fixes the spray cooling cover on the bottom plate
Data Source
AI summary
A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.