Spray Manifold Design for Uniform Substrate Cleaning
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Solution Overview
Problem
Current substrate cleaning methods after chemical mechanical polishing (CMP) suffer from poor uniformity of spray distribution, leading to streaking, residue, and non-uniform oxide etch rates, which can cause device failure.
Innovation Solution
A spray manifold with an elongated body featuring a line of holes, a central bore, and a linear slot, designed to provide a uniform spray pattern across the substrate, optimized for improved chemical coverage and reduced defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional nozzles are used in spray bars, then the structure is simple, but the spray uniformity is poor
Solution Approach 1:
The spray bar is divided into multiple sections with different nozzle configurations. Each section has nozzles oriented at different angles (e.g., 45 degrees, 90 degrees, 135 degrees) to create overlapping spray patterns that collectively achieve uniform coverage across the substrate surface.
Solution Approach 2:
Different regions of the spray bar are equipped with nozzles having different spray angles and orientations tailored to their specific locations. This local customization ensures that each region contributes optimally to the overall uniformity, with nozzles positioned and angled to address specific coverage requirements of different substrate areas.
2Manufacturing precision
If conventional nozzles are used, then the device complexity is low, but the oxide etch rate uniformity is poor
Solution Approach 1:
The spray bar design segments the substrate surface into multiple zones, each served by nozzles with specific orientations. This segmentation allows precise control of chemical delivery to different regions, ensuring uniform oxide etch rates across the entire substrate by addressing local variations in flow distribution.
Solution Approach 2:
The spray bar employs asymmetric nozzle orientations where nozzles on different sides of the bar are angled differently relative to the substrate. This asymmetric configuration compensates for gravitational effects and flow distribution variations, creating balanced chemical coverage that results in uniform etch rates across the substrate surface.
3Manufacturing precision
If conventional nozzles are used, then the design is simple, but the chemical coverage resolution is insufficient
Solution Approach 1:
The spray bar is segmented into multiple nozzle groups with different orientations and spacing configurations. This segmentation increases the spatial resolution of chemical delivery by creating a finer grid of spray impingement points across the substrate, allowing precise control over chemical coverage at the required resolution.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances cleaning uniformity, reducing defects and film delamination, and achieving a smoother etch rate compared to conventional methods.
Implementation Method 1
spray manifold with an elongated body featuring a line of holes, a central bore, and a linear slot, designed to provide a uniform spray pattern across the substrate
Data Source
AI summary
A spray manifold for a brush box is disclosed which includes an elongated body having a plurality of holes formed in a line along a direction parallel to a longitudinal axis of the body, a linear slot formed along a length of the body aligning with the line of the holes, a central bore formed along the length of the body and between each of the holes and the slot, and a cover disposed on the slot.