Independent Spray Nozzle Control for Semiconductor Substrate Processing
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Solution Overview
Problem
Existing semiconductor processing equipment lacks the ability to selectively process specific areas of semiconductor substrates, leading to uniform processing of entire surfaces, which can be inefficient and wasteful, as certain areas may require different conditions or no processing at all.
Innovation Solution
A system with a spray module and nozzle control module that allows for independent control of each spray nozzle, enabling customizable delivery of processing substances based on the location and type of processing needed, with the ability to switch between different substances and adjust the amount applied, ensuring precise application during semiconductor manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If uniform processing is applied to the entire surface area of the semiconductor substrate, then the processing is simple and consistent, but material usage increases and efficiency decreases
Solution Approach 1:
The patent divides the processing system into multiple independently controllable spray nozzles arranged in columns, where each nozzle can be controlled separately to process only specific regions of the substrate. This segmentation allows selective application of processing substances to reduce material usage while maintaining system manageability through modular control.
Solution Approach 2:
The patent implements local quality by enabling different spray nozzles to deliver different processing substances or different amounts of the same substance to different locations on the substrate. The nozzle control module adjusts spray parameters based on location-specific requirements, allowing optimized material usage in different regions without requiring complex reconfiguration of the entire system.
2Productivity
If selective processing of specific areas is implemented, then material usage is reduced and efficiency improves, but the processing equipment complexity increases
Solution Approach 1:
The processing system is segmented into multiple independently controllable spray nozzles that can be activated selectively based on the processing requirements of different substrate regions. This segmentation enables parallel processing of multiple areas simultaneously, improving overall productivity while keeping each individual nozzle simple in design.
Solution Approach 2:
The patent introduces dynamic control through the nozzle control module, which can activate, deactivate, or adjust spray parameters of individual nozzles in real-time based on the substrate's processing needs. This dynamic adaptability allows the system to optimize productivity for different processing scenarios without requiring permanent physical reconfiguration, balancing flexibility with operational simplicity.
3Manufacturing precision
If the entire surface is processed uniformly, then the process is fast and simple, but product quality may suffer due to unnecessary processing in non-critical areas
Solution Approach 1:
The patent applies local quality by delivering tailored processing substances to specific regions of the substrate based on their unique requirements. Critical areas receive appropriate processing substances and parameters, while non-critical areas are either processed differently or skipped entirely. This location-specific approach enhances manufacturing precision without requiring time-consuming sequential processing of the entire surface.
Solution Approach 2:
The patent implements partial action by processing only the necessary portions of the substrate that require treatment, rather than uniformly processing the entire surface. The nozzle control module identifies and activates only those nozzles corresponding to areas needing processing, eliminating wasted time on non-critical regions while maintaining high precision in treated areas through focused application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for optimized semiconductor processing by enabling precise application of processing substances, reducing material usage, minimizing damage to the surface, and improving product quality, manufacturability, and reducing manufacturing time and costs.
Implementation Method 1
A spray module may include a plurality of spray nozzles, and each spray nozzle may be independently controlled so that one spray nozzle may be delivering a processing substance while an adjacent spray nozzle may be turned off
Data Source
AI summary
An apparatus includes a spray module with at least one column of spray nozzles. Each spray nozzle is configured to deliver a processing substance on a semiconductor substrate during a process for semiconductor manufacturing as the semiconductor substrate moves past the spray module. The at least one column of spray nozzles is arranged with respect to a direction of travel of the semiconductor substrate so the semiconductor substrate passes the spray nozzles. A location module identifies a location of the semiconductor substrate with respect to the spray module. A spray pattern module determines a spray pattern of where a processing substance is to be delivered to the semiconductor substrate and a nozzle control module actuates each spray nozzle independently based on the spray pattern and a location of the semiconductor identified by the location module.