Spray Pattern Generation for 3D PCB Solder Paste Application
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Solution Overview
Problem
In the field of surface mount technology, determining the trajectory, start point, end point, and volume of spray-printing line segments quickly and accurately is a core technical difficulty in the spray printing of solder paste, particularly for 3D printed circuit boards and Package-on-Package (POP) soldering, where traditional stencil printing methods fall short.
Innovation Solution
A method and system for generating spray patterns that involve obtaining a first opening shape, a preset spray printing dot, and calculating a qualification ratio T based on the total solder-paste weight and length of spray-printing line segments, with adjustments to parameters until the qualification ratio falls within a predetermined range, ensuring accurate determination of the spray pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If spray printing is used to apply solder paste, then precision of solder paste application is improved, but difficulty in determining trajectory and volume quickly increases
Solution Approach 1:
The patent performs preliminary calculations of spray trajectory, start point, end point, and volume before the actual spray printing process. By pre-determining these parameters through automated computation based on PCB geometry and solder paste requirements, the system eliminates real-time complexity during execution while maintaining high precision application.
Solution Approach 2:
The patent replaces manual or mechanical determination of spray parameters with automated computational methods. Using software algorithms to calculate trajectory and volume based on digital PCB models substitutes complex mechanical measurement and adjustment processes, thereby reducing operational difficulty while preserving precision.
2Loss of time
If stencil printing is used, then product development cycle is extended due to new stencil requirements, but device complexity is reduced
Solution Approach 1:
The patent uses digital copies or virtual models of the PCB design to generate spray printing parameters directly from CAD data. This digital copying approach eliminates the need for physical stencil creation and replacement, allowing rapid adaptation to design changes without extending the development cycle or requiring complex stencil management.
Solution Approach 2:
The patent enables rapid adaptation to design changes by modifying digital parameters and coordinates in the spray printing program rather than physically changing stencils. This parameter-based approach allows quick updates to trajectory, volume, and positioning data, significantly reducing product development time when PCB designs are modified.
3Adaptability or versatility
If spray printing is used, then adaptability to 3D PCBs and POP soldering is improved, but calculation complexity of spray parameters increases
Solution Approach 1:
The patent extends spray printing capability to three-dimensional PCB structures and Package-on-Package configurations by incorporating Z-axis height information and spatial coordinates into the spray parameter calculations. This multi-dimensional approach enables accurate solder paste application on complex 3D surfaces while the automated computation handles the increased calculation complexity.
Solution Approach 2:
The patent employs dynamic calculation methods that automatically adjust spray parameters based on real-time analysis of PCB geometry, component positions, and solder paste flow characteristics. This dynamic computation adapts to varying 3D structures and POP configurations, managing calculation complexity through iterative algorithms that respond to specific geometric conditions.
Data Source
AI summary
A method and a system for generating spray patterns, an electronic device, and a storage medium. The method includes: step 1: obtaining a first opening shape; step 2: obtaining a preset spray printing dot; step 3: obtaining a qualification ratio T according to a ratio of a total solder-paste weight Q corresponding to a total length of spray-printing line segments to a solder-paste weight Q1 required for the first opening shape or a ratio of the total length of all the spray-printing line segments to a line length LA, wherein the spray-printing line segments are line segments finally within the first opening shape, and the qualification ratio is a weight ratio or a length ratio; and step 4: determining a relationship among the qualification ratio T, a preset maximum qualification ratio Tmax, and a preset minimum qualification ratio Tmin to obtain the first spray pattern.