Spring-Biased Heat Spreader Assembly for Stable PCB Cooling
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Solution Overview
Problem
Components on a printed wiring board generate significant heat, leading to increased temperature and potential performance issues or failure, necessitating effective heat dissipation solutions.
Innovation Solution
An apparatus comprising a heat sink, heat spreader, resilient bias means, and retainers to ensure thermal conductivity and mitigate manufacturing tolerances and vibrations, using protrusions and thermal interface material to connect components, spreader, and sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface material is used to connect component to heat spreader and heat spreader to heat sink, then thermal conductivity is improved, but manufacturing tolerances and vibrations cause instability in thermal contact
Solution Approach 1:
The resilient bias means (spring) provides dynamic adjustment capability, allowing the heat spreader to move and maintain optimal thermal contact with both the component and heat sink despite manufacturing tolerances, vibrations, or thermal expansion. This dynamic mechanism ensures continuous stable thermal contact rather than rigid fixed contact.
Solution Approach 2:
The resilient bias means acts as an intermediary element between the heat spreader and heat sink, absorbing mechanical stresses and vibrations while maintaining thermal conductivity. The spring mediates the connection, isolating the thermal path from mechanical instability.
2Stability of the object's composition
If rigid connection is used between heat sink and heat spreader, then structural stability is improved, but thermal conductivity decreases due to manufacturing tolerances and vibrations
Solution Approach 1:
Replacing rigid connection with a resilient bias means (spring) allows the system to maintain structural stability while dynamically adjusting to manufacturing tolerances and vibrations. The spring provides continuous contact force ensuring stable thermal conductivity without requiring perfect rigid alignment.
3Measurement precision
If protrusions extend through heat spreader to abut printed wiring board, then positioning precision is improved, but risk of damaging the board increases
Solution Approach 1:
The resilient bias means (spring) positioned between the heat sink and heat spreader acts as a cushioning element that prevents excessive force from being transmitted to the printed wiring board. The spring absorbs shock and limits the maximum contact force, protecting the board from damage while still achieving accurate positioning through the protrusions and apertures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conductivity and stability, effectively dissipating heat while accommodating manufacturing tolerances and vibrations, ensuring component performance and longevity.
Implementation Method 1
a resilient bias means positioned between the heat sink and the heat spreader
Implementation Method 2
thermal interface material coupling the at least one component to the heat spreader and thermal interface material coupling the heat spreader to the heat sink
Data Source
Figure 1~5
Figure 6A~6C
Figure 7A~7B
AI summary
An apparatus comprising: a heat sink; a heat spreader; a printed wiring board; a resilient bias means positioned between the heat sink and the heat spreader; and at least one retainer configured to force the heat sink towards the heat spreader against the resilient bias means and configured to force the printed wiring board towards the heat spreader.