Spring-Clamped Optical Semiconductor Arrangement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Optical semiconductor elements, such as laser diodes in projectors, face challenges with heat dissipation and optical alignment due to production tolerances, leading to reduced heat conduction and image quality.
Innovation Solution
A spring element is used to firmly attach the semiconductor housing to the carrier, providing a spring force for effective heat dissipation and maintaining a constant distance between the semiconductor and optical elements, ensuring consistent positioning and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor housing is firmly attached to the carrier using rigid fixing, then heat dissipation is improved, but positioning precision deteriorates due to production tolerances
Solution Approach 1:
The patent employs a spring element instead of rigid fixing to dynamically adapt to production tolerances. The spring provides continuous contact force while allowing positional adjustment, enabling the semiconductor housing to be firmly attached for heat dissipation while accommodating variations in manufacturing precision.
2Manufacturing precision
If production tolerances are reduced to improve positioning precision, then optical quality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent changes the parameter of the fixing mechanism from rigid to elastic (spring element), which allows the system to achieve positioning precision without requiring extremely tight manufacturing tolerances. The spring's elasticity compensates for dimensional variations, reducing manufacturing complexity while maintaining optical quality.
3Temperature
If the heat sink contact area is increased to improve heat dissipation, then temperature control is improved, but the risk of insufficient contact due to tolerances increases
Solution Approach 1:
The spring element acts as a cushioning mechanism that compensates for potential contact gaps before they occur. By providing continuous elastic pressure, the spring ensures reliable thermal contact between the semiconductor housing and carrier, preventing insufficient contact that would result from production tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures effective heat dissipation and maintains optical quality by ensuring a firm, consistent heat-conducting contact and precise optical element positioning, improving the performance of semiconductor element arrays like laser diodes.
Implementation Method 1
a spring element which loads the semiconductor housing with a spring force in the direction of the semiconductor element carrier
Implementation Method 2
the semiconductor housing lies indirectly or directly against the semiconductor element carrier... effective heat dissipation... firm, consistent heat-conducting contact
Data Source
AI summary
An arrangement with a multiplicity of optical semiconductor elements is disclosed. The semiconductor elements are respectively clamped against a semiconductor element carrier by way of a spring element. Additionally lying against the spring element is an optical element assigned to a respective semiconductor element, the spring element in this case being configured in such a way that it defines a fixed distance between the semiconductor element and the optical element.