Spring-Assisted Semiconductor Cleaving for Consistent Pull Force

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Solution Overview

Problem

Conventional cleave systems for semiconductor structures result in undesirable surface roughness and inconsistent cleave pull force, leading to roughness patterns and hillocks during epitaxial growth, due to the reliance on suction cups and motor-driven tension, which are difficult to tune for improved quality.

Innovation Solution

A cleave system utilizing a movable cleave arm with spring members that store energy as the arm is raised, applying a cleave force through suction rods and suction cups to initiate and propagate the cleave, allowing the stored spring energy to separate the semiconductor structure into two pieces, reducing dependence on motor properties and cleave arm mass.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional motor-driven tension is used to apply cleave force, then the cleave process can be initiated, but surface roughness increases and cleave arcs form

Engineering Contradiction:

Improvesurface roughnessVSAvoidcleave force consistency

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The spring member is pre-compressed before the cleave operation to store elastic energy. This preliminary action allows the spring to automatically apply a consistent cleave force when released, eliminating the need for motor control during the actual cleave and preventing surface roughness and cleave arcs

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the motor-driven mechanical tension system with a spring-based elastic energy storage system. The spring member converts stored elastic energy into a controlled cleave force, substituting the motor control mechanism with a passive elastic mechanism that inherently provides force consistency

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If motor characteristics and cleave arm mass are used to control cleave force, then the cleave can propagate, but the parameters are difficult to tune for improved quality

Engineering Contradiction:

Improvecleave qualityVSAvoidparameter tuning complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent changes the fundamental parameter from motor characteristics and arm mass to spring compression distance and spring constant. These spring parameters are easier to tune and adjust for different cleave requirements, providing better control over cleave quality without complex motor control parameters

Inventive Principle:

Principle #35Parameter changes

3Reliability

If suction cups under vacuum are used to grasp the structure, then the structure can be held, but inconsistent cleave pull force results in surface roughness patterns

Engineering Contradiction:

Improvestructure holdingVSAvoidsurface roughness uniformity

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The spring member is pre-compressed to store energy before the cleave is initiated. This preliminary energy storage ensures that when the cleave propagates, a consistent and sufficient pull force is applied uniformly across the structure, preventing surface roughness patterns while maintaining reliable structure holding through the suction cups

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system achieves consistent and improved surface roughness characteristics by relying on stored spring energy for cleaving, reducing surface roughness and cleave arcs, and allowing for adjustable pre-compression to optimize cleave dynamics.

Implementation Method 1

A spring member applies a cleave force to the semiconductor structure when the cleave arm is in the raised position

Methodology Applied

Scientific EffectSpring energy storage: Spring

Implementation Method 2

spring members for cleaving a semiconductor structure and methods for cleaving such structures... utilize a movable cleave arm with spring members that store energy as the arm is raised

Methodology Applied

Scientific EffectElastic potential energy: Elasticity

Implementation Method 3

Conventional cleave systems use suction cups that are under vacuum to grasp the top and bottom surfaces of the structure to be cleaved

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Implementation Method 4

suction cups that are under vacuum to grasp the top and bottom surfaces

Methodology Applied

Scientific EffectPressure differential: Pressure Gradient

Data Source

PatentUS12148635B2Cleave systems having spring members for cleaving a semiconductor structure and methods for cleaving such structures

Publication Date: 2024.11.19 GLOBALWAFERS CO LTD

AI summary

Cleave systems for cleaving a semiconductor structure are disclosed. The cleave systems may include a cleave arm that is moveable from a starting position to a raised position in which a cleave stress is applied to the semiconductor structure. Spring members store energy as the cleave arm is raised with the stored spring energy causing the structure to cleave into two pieces upon initiation of the cleave across the structure.