Spring Clip Carrier for Electronic Chip Mounting

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Solution Overview

Problem

Conventional mounting techniques for low-pass EMI filters in harsh motor environments, such as automotive applications, fail to securely hold and connect electronic chips under conditions of thermal shock and vibration, leading to potential disconnection and interference issues.

Innovation Solution

A carrier device with a dielectric frame and sheet metal spring clips, featuring inner and outer tabs, allows for easy installation and secure mechanical and electrical connection of the chip without soldering, using a press fit mechanism that engages contact pads and holder terminals.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional mounting techniques are used for electronic chips in motor housings, then the chip can be installed, but the chip cannot securely withstand thermal shock and vibration in harsh environments

Engineering Contradiction:

Improvechip retention under thermal shock and vibrationVSAvoidmounting structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The spring clips are designed to be resilient and flexible, allowing them to dynamically adapt to thermal expansion and vibration rather than being rigidly fixed. The clips can flex and return to their original position, maintaining secure contact with the chip under varying environmental conditions.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The mounting structure is divided into separate functional components: the dielectric frame provides structural support and electrical isolation, while the spring clips provide mechanical retention and electrical connection. This segmentation allows each component to be optimized for its specific function.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If soldering is used to connect the chip, then strong electrical connection is achieved, but the installation process becomes complex and time-consuming

Engineering Contradiction:

Improveinstallation simplicityVSAvoidelectrical connection stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The electrical connection mechanism replaces traditional soldering (thermal-chemical process) with a mechanical spring contact system. The spring clips provide both mechanical retention and electrical connection through direct contact, eliminating the need for soldering while maintaining connection stability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The spring clips are designed to automatically make and maintain electrical contact with the chip terminals through their resilient nature. The connection is self-adjusting and requires no additional assembly steps or materials beyond the simple insertion of the chip into the carrier device.

Inventive Principle:

Principle #25Self-service

3Reliability

If the chip is directly mounted in the motor housing, then installation is simple, but the chip cannot be securely held under harsh environmental conditions

Engineering Contradiction:

Improvechip holding securityVSAvoidinstallation ease

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The carrier device serves as an intermediary between the chip and the motor housing. It provides the secure mechanical retention through spring clips while maintaining electrical connections, allowing the chip to be easily installed without direct mounting to the housing.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The carrier device combines multiple functions into a single component: structural support, electrical isolation (through dielectric material), mechanical retention (through spring clips), and electrical connection (through clip contacts). This merging simplifies the overall installation process while ensuring reliable chip holding.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides reliable mechanical retention and electrical connection of the chip, ensuring stable operation under harsh conditions by eliminating the need for soldering and enhancing the chip's durability against thermal shock and vibration.

Implementation Method 1

A plurality of sheet metal spring clips each has a 180° bend mounted on the top of a wall, and has inner and outer tabs. The inner tabs engage contact pads of the chip while the outer tabs engage terminals of a holder that holds the frame.

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS7511368B2Carrier device for electronic chip

Publication Date: 2009.03.31 ITT MANUFACTURING ENTERPRISES LLC

AI summary

A surface mount electronic chip (10) is mounted on a holder (70) and electrically connected to holder terminals (74,76, 80) by the use of a carrier device (30). The carrier device has clips (36) mounted on walls of the carrier frame. The chip is merely pressed into a cavity (48) between inner tabs (44) of the chips. The carrier with the chip in place is merely pressed into a cradle (78) formed in the holder by the holder terminals, so outer tabs (46) of the clips press against the holder terminals.