Spring Clips for Mounting Optics on Circuit Boards
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Solution Overview
Problem
Existing optic element mounting systems are expensive, inflexible, and require additional mechanical aids, often failing to securely connect optic elements to light sources or light sensors without adhesives, and do not allow for easy modification of radiation properties.
Innovation Solution
A system of spring-loaded clips adhered to a substrate, which can securely hold and align optic elements relative to light sources or light sensors, using metallic materials with tensile strength and ductility, allowing for solder-bonding to conductive traces on printed circuit boards, and incorporating latches for secure engagement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesives or complex snap-in assemblies are used to mount optic elements, then secure mounting is achieved, but cost increases and flexibility to modify radiation properties decreases
Solution Approach 1:
The mounting system is divided into separate functional components: clips that provide mechanical retention, adhesive pads for bonding, and alignment features. This segmentation allows each component to perform its specific function efficiently while reducing overall system complexity and cost.
Solution Approach 2:
The clips serve multiple functions simultaneously: they provide mechanical retention of the optic element, facilitate alignment through integrated alignment features, and enable thermal management through heat dissipation paths. This multi-functionality reduces the need for separate components, lowering complexity and cost.
2Reliability
If traditional mounting methods are used, then optic elements can be secured, but additional mechanical mounting aids are required, increasing device complexity
Solution Approach 1:
The alignment features and mounting functions are merged into a single integrated clip structure. The clips include built-in alignment features that work together with the mounting mechanism, eliminating the need for separate alignment aids and reducing overall device complexity.
Solution Approach 2:
The clips are designed to self-align and self-retain the optic element through their geometric features and elastic properties. The spring-loaded design automatically adjusts to accommodate tolerances and secures the optic element without requiring additional adjustment mechanisms or aids.
3Stability of the object's composition
If rigid mounting structures are used, then stable positioning is achieved, but heat dissipation capability is reduced
Solution Approach 1:
The spring-loaded clips provide flexible mechanical retention while maintaining stable positioning through their elastic deformation capabilities. This flexibility allows for thermal expansion and contraction without compromising positional stability, while the metallic construction provides efficient heat dissipation paths.
Solution Approach 2:
The mounting system combines metallic clip materials with adhesive materials to create a composite structure that provides both mechanical stability and thermal management capabilities. The metallic portions conduct heat away from the optic element while the adhesive provides stable bonding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a cost-effective, flexible, and secure method for mounting optic elements, eliminating the need for adhesives and complex assemblies, while allowing for alignment and heat dissipation, and enabling customization of light distribution patterns.
Implementation Method 1
The spring loaded section may be configured to deflect in position as an optic element is positioned proximate the clip
Implementation Method 2
An optic element mounting system may include at least two clips adhered to a substrate
Data Source
AI summary
Clips are provided to secure optic element systems to a printed circuit board. Associated mounting systems may, for example, eliminate direct adhesion of an optic element to an associated illumination source (e.g., LED). Thereby, thermal management of the system may be improved, adding flexibility in, for example, mounting height and tilt of an optic element. Thus, manufacturing cost, associated with mounting optic elements to L.E.D. arrays, may be reduced. Associated mounting systems may enable a direct electrical connection from a printed circuit to, for example, optical path control elements embedded within an optic element using, for example, various electro-optical control technologies.


