Spring Clips for Mounting Optics on Circuit Boards

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Solution Overview

Problem

Existing optic element mounting systems are expensive, inflexible, and require additional mechanical aids, often failing to securely connect optic elements to light sources or light sensors without adhesives, and do not allow for easy modification of radiation properties.

Innovation Solution

A system of spring-loaded clips adhered to a substrate, which can securely hold and align optic elements relative to light sources or light sensors, using metallic materials with tensile strength and ductility, allowing for solder-bonding to conductive traces on printed circuit boards, and incorporating latches for secure engagement.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If adhesives or complex snap-in assemblies are used to mount optic elements, then secure mounting is achieved, but cost increases and flexibility to modify radiation properties decreases

Engineering Contradiction:
Improvesecure mountingVSAvoidcomplex assemblies
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The mounting system is divided into separate functional components: clips that provide mechanical retention, adhesive pads for bonding, and alignment features. This segmentation allows each component to perform its specific function efficiently while reducing overall system complexity and cost.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The clips serve multiple functions simultaneously: they provide mechanical retention of the optic element, facilitate alignment through integrated alignment features, and enable thermal management through heat dissipation paths. This multi-functionality reduces the need for separate components, lowering complexity and cost.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If traditional mounting methods are used, then optic elements can be secured, but additional mechanical mounting aids are required, increasing device complexity

Engineering Contradiction:
Improvesecure connectionVSAvoidadditional mechanical aids
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The alignment features and mounting functions are merged into a single integrated clip structure. The clips include built-in alignment features that work together with the mounting mechanism, eliminating the need for separate alignment aids and reducing overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The clips are designed to self-align and self-retain the optic element through their geometric features and elastic properties. The spring-loaded design automatically adjusts to accommodate tolerances and secures the optic element without requiring additional adjustment mechanisms or aids.

Inventive Principle:
Principle #25Self-service

3Stability of the object's composition

If rigid mounting structures are used, then stable positioning is achieved, but heat dissipation capability is reduced

Engineering Contradiction:
Improvestable positioningVSAvoidheat dissipation
Core Design Contradiction:
Stability of the object's compositionVSLoss of energy

Solution Approach 1:

The spring-loaded clips provide flexible mechanical retention while maintaining stable positioning through their elastic deformation capabilities. This flexibility allows for thermal expansion and contraction without compromising positional stability, while the metallic construction provides efficient heat dissipation paths.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The mounting system combines metallic clip materials with adhesive materials to create a composite structure that provides both mechanical stability and thermal management capabilities. The metallic portions conduct heat away from the optic element while the adhesive provides stable bonding.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides a cost-effective, flexible, and secure method for mounting optic elements, eliminating the need for adhesives and complex assemblies, while allowing for alignment and heat dissipation, and enabling customization of light distribution patterns.

Implementation Method 1

The spring loaded section may be configured to deflect in position as an optic element is positioned proximate the clip

Methodology Applied
Scientific EffectElasticity: Elasticity

Implementation Method 2

An optic element mounting system may include at least two clips adhered to a substrate

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS9857554B2Spring clips for mounting optics structures on an associated circuit board, and assemblies including the spring clips
Publication Date: 2018.01.02 SMART VISION LIGHTS
  • US9857554B2 patent drawing
  • US9857554B2 patent drawing
  • US9857554B2 patent drawing

AI summary

Clips are provided to secure optic element systems to a printed circuit board. Associated mounting systems may, for example, eliminate direct adhesion of an optic element to an associated illumination source (e.g., LED). Thereby, thermal management of the system may be improved, adding flexibility in, for example, mounting height and tilt of an optic element. Thus, manufacturing cost, associated with mounting optic elements to L.E.D. arrays, may be reduced. Associated mounting systems may enable a direct electrical connection from a printed circuit to, for example, optical path control elements embedded within an optic element using, for example, various electro-optical control technologies.