Spring Contact With Elastic Portions For Fine-Pitch IC Testing
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Solution Overview
Problem
Conventional spring contacts are inefficient for testing ICs with rapidly improved and diversified designs, and cannot effectively handle superhigh-speed signal processing or fine-pitch lead arrays, limiting their use in various sockets and electronic appliances.
Innovation Solution
A spring contact design with a minimum length of 1.0 mm or less, featuring a plate-shaped lower contact pin, symmetric elastic portions, and moving grooves, allowing for efficient superhigh-speed signal processing and electromagnetic wave shielding, while accommodating fine-pitch lead arrays of 0.4 mm or less, and enabling efficient assembly without bolts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional spring contacts are used, then assembly is simple, but they cannot handle superhigh-speed signal processing and fine-pitch lead arrays
Solution Approach 1:
The spring contact is divided into multiple functional segments: upper contact pin with contact portion, lower contact pin with contact portion, symmetric elastic portions, locking protrusions, and moving grooves. Each segment performs a specific function, allowing the overall structure to achieve high adaptability for superhigh-speed signals and fine-pitch applications while maintaining manageable complexity through modular functional design.
Solution Approach 2:
Different portions of the spring contact have specialized local characteristics: the contact portions are designed with specific shapes for fine-pitch lead engagement, the elastic portions provide localized flexibility, and the locking protrusions with moving grooves create controlled movement zones. This local quality optimization enables the structure to handle superhigh-speed signals and fine-pitch arrays effectively.
2Speed
If spring contact length is reduced to 1.0 mm or less, then signal processing speed improves, but manufacturing precision requirements increase
Solution Approach 1:
The spring contact incorporates dynamic elements including elastic portions that can deform, locking protrusions that engage with moving grooves, and a spring component that provides flexible compression. This dynamic design allows the short 1.0 mm structure to achieve superhigh-speed signal processing capability while the elastic and spring components provide tolerance compensation, reducing the impact of manufacturing precision variations.
Solution Approach 2:
The invention changes key parameters: reduces overall length to 1.0 mm or less for high-speed performance, uses symmetric elastic portions with controlled thickness variations, and implements a spring component with specific coil geometry. These parameter changes enable superhigh-speed signal processing while the spring's mechanical properties provide inherent compensation for manufacturing tolerances.
3Adaptability or versatility
If symmetric elastic portions with moving grooves are added, then adaptability to fine-pitch leads improves, but device complexity increases
Solution Approach 1:
While the overall structure uses symmetric elastic portions for balance, the contact portions and locking protrusions are asymmetrically positioned and shaped to specifically engage with fine-pitch lead arrays. The moving grooves are asymmetrically configured to guide the locking protrusions during insertion, providing adaptability to fine-pitch applications while the symmetry in elastic portions maintains structural simplicity.
Solution Approach 2:
The symmetric elastic portions with integrated locking protrusions and moving grooves serve multiple functions simultaneously: providing mechanical flexibility, enabling controlled movement during assembly, securing the contact pins in position, and adapting to fine-pitch lead configurations. This multi-functionality reduces the need for separate components, thereby limiting the increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient testing of ICs with fine-pitch lead arrays and supports superhigh-speed signal processing, providing a versatile spring contact and socket configuration for diverse applications, including electromagnetic wave shielding and various soldering structures.
Implementation Method 1
a spring 190 that is fitted over an assembly of the upper and lower contact pins at a position between the upper and lower contact pins
Data Source
AI summary
A spring contact and a socket embedded with spring contacts. The spring contact includes an upper contact pin having a contact portion, two spring holding protrusions and a body, a lower contact pin coupled to the upper contact pin, and a spring fitted over the assembly of the upper and lower contact pins, wherein the body has two symmetric elastic portions with both an oblique surface and a locking protrusion, in which a moving slit is formed between the elastic portions so as to provide a moving space for an opposite contact pin, with moving grooves being formed to movably receive the locking protrusions of an opposite contact pin and to be in electric contact with the locking protrusions.