Spring Contact Microcomponent Fastening
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Solution Overview
Problem
Miniaturized sensor circuits, such as Land Grid Arrays (LGAs), face challenges in second-level packaging due to thermal stress, organic residue contamination, and shearing effects during soldering or welding processes, which can lead to damage and short circuits.
Innovation Solution
An electronic component design that uses a spring element with a latching device to securely attach a microcomponent to a carrier element without thermal connection methods, ensuring high contact force transmission without friction, thus avoiding damage and contamination, and allowing for inexpensive, environmentally friendly manufacturing without printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal connection processes such as soldering, conductive gluing or welding are used to fix and contact the microcomponent and carrier element, then secure electrical contact is achieved, but thermal stress and contamination occur causing damage and short circuits
Solution Approach 1:
The patent replaces thermal connection processes (soldering, welding, conductive gluing) with a purely mechanical spring contact system. The spring element applies contact force through elastic deformation, eliminating thermal stress and contamination from flux residues while achieving reliable electrical contact through mechanical pressure.
Solution Approach 2:
The spring element acts as an intermediary between the microcomponent and carrier element. It transmits contact force without direct thermal contact, mediating the connection through elastic deformation and mechanical pressure, thereby avoiding thermal damage and contamination.
2Reliability
If high contact force is applied to secure fastening of the microcomponent, then reliable electrical contact is achieved, but friction causes scratches and chip formation
Solution Approach 1:
The patent eliminates friction-based mechanical contact by using a spring element that applies contact force through elastic deformation. The spring contacts the microcomponent pads without sliding friction, preventing scratches and chip formation while maintaining secure fastening and reliable electrical contact.
3Reliability
If printed circuit board or substrate is used for mounting microcomponents, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the printed circuit board or substrate from the system. The carrier element is designed as a simple metallic structure without circuit traces, reducing manufacturing complexity and cost while maintaining electrical connection through the spring contact mechanism.
Solution Approach 2:
The patent uses a simple, inexpensive metallic carrier element without complex circuit board structures. This simplified design reduces manufacturing cost and complexity while achieving the necessary electrical connection function through the spring contact system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves secure mechanical and electrical contact between the microcomponent and carrier element, reducing thermal stress, avoiding contamination, and enabling cost-effective production of miniaturized components like acceleration sensors for the motor vehicle sector.
Implementation Method 1
the contact force is transmitted without friction and therefore without damaging the contact points
Data Source
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AI summary
AN electronic component includes at least one microcomponent which is contacted with, and fastened to, a support element. The support element includes a spring element which is configured for fastening the microcomponent, and the spring element is engaged in the support element with the aid of a detent in order to fasten the microcomponent to the support element.