Spring Contact Test Socket for High-Speed Signal Integrity
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Solution Overview
Problem
Existing spring contacts for IC testing face challenges in durability degradation, high contact resistance, and short service life when processing high-speed signals, particularly due to limitations in manufacturing thin structures and the inferior elastic characteristics of rubber-type sockets, which affect their ability to maintain signal integrity over time.
Innovation Solution
A test socket with spring contacts featuring upper and lower contact pins that cross each other, supported by a coil spring, and a thin structure design with specific geometric features such as grooves, shoulder protrusions, and elastic portions, along with a silicone caulking mechanism to secure the contact pins, which reduces contact resistance and enhances durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rubber-type sockets are used for IC testing, then ease of manufacture is improved, but durability and service life deteriorate due to inferior elastic characteristics
Solution Approach 1:
The spring contact combines metal contact pins with elastic properties and a coil spring mechanism, creating a composite structure that maintains superior elasticity and durability while being manufacturable. The metal components provide both structural integrity and elastic recovery capability.
Solution Approach 2:
The spring contact incorporates a coil spring that provides dynamic elastic recovery, allowing the contact pins to return to their original position after deformation. This dynamic mechanism ensures consistent contact pressure and signal integrity over extended service life.
2Reliability
If conventional spring contacts are used for high-speed signal processing, then electrical connection is established, but contact resistance increases and signal integrity deteriorates over time
Solution Approach 1:
The spring contact features optimized contact portions with specific geometric configurations that concentrate elastic force at the contact points. This local quality enhancement ensures low contact resistance and stable electrical connection for high-speed signals.
Solution Approach 2:
The design modifies the elastic characteristics and geometric parameters of the contact pins to optimize electrical performance. By adjusting the spring constant, contact area, and material properties, the contact resistance is minimized while maintaining signal integrity.
3Device complexity
If thin structure design is implemented in test sockets, then device complexity is reduced and manufacturing is simplified, but manufacturing precision requirements increase
Solution Approach 1:
The spring contact is divided into distinct functional segments: contact pins, coil spring, and mounting structure. This segmentation allows each component to be manufactured and assembled separately, reducing overall complexity while maintaining precision through modular construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the test socket to maintain excellent electrical characteristics for high-speed signal processing, extend service life, and minimize durability degradation, while reducing contact resistance and ensuring reliable long-term performance.
Implementation Method 1
a spring elastically supporting the upper contact pin and the lower contact pin
Implementation Method 2
a spring elastically supporting the upper contact pin and the lower contact pin
Data Source
AI summary
The present invention relates to a test socket having a thin structure that can reduce durability degradation of a contact itself, have excellent electrical characteristics in processing high-speed signals, and can extend a service life thereof, and relates to spring contacts suitable thereto. The test socket according to the present invention includes: a plurality of spring contacts (100) each of which includes an upper contact pin (110) and a lower contact pin (120) that are assembled cross each other, and a spring (130) supporting the upper and lower contact pins (110 and 120); a main plate (1110) having a plurality of accommodating holes (1111) in which the respective spring contacts (100) are accommodated, with first openings (1113); and a film plate (1120) provided on a lower portion of the main plate (1110), and having second openings (1121).