Spring Contact Connector With Direct Through-Hole Pin Connection
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Solution Overview
Problem
The manufacturing process of connectors with conductive through holes is complex and costly due to the need for processes like electroplating and seed layer formation, which complicates the electrical connection between spring contacts and substrates, leading to reduced yield and increased costs.
Innovation Solution
A connector design featuring a substrate with a conductive through hole and a spring contact with a protruding pin that directly contacts the through hole, eliminating the need for electroplating and seed layer formation processes, thereby simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electroplating and seed layer formation processes are used to connect spring contacts to substrate, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates the complex electroplating and seed layer formation processes from the manufacturing flow. Instead of using traditional multi-step electroplating methods, the invention directly forms conductive through-holes in the substrate and inserts spring contact elements, removing unnecessary intermediate layers and processes while maintaining electrical connectivity.
Solution Approach 2:
The patent employs a simpler, more disposable-like approach by using pre-formed spring contact elements with integrated conductive features. Rather than building up complex plated structures, the invention uses straightforward insertable elements that provide electrical connection without requiring elaborate manufacturing infrastructure, reducing both process complexity and cost.
2Reliability
If traditional electroplating and seed layer formation processes are used to connect spring contacts to substrate, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates the costly electroplating and seed layer formation processes from the manufacturing flow. Instead of using traditional multi-step electroplating methods, the invention directly forms conductive through-holes in the substrate and inserts spring contact elements, removing unnecessary intermediate layers and processes while maintaining electrical connectivity.
Solution Approach 2:
The patent employs a simpler, more disposable-like approach by using pre-formed spring contact elements with integrated conductive features. Rather than building up complex plated structures, the invention uses straightforward insertable elements that provide electrical connection without requiring elaborate manufacturing infrastructure, reducing both process complexity and cost.
3Reliability
If traditional electroplating and seed layer formation processes are used to connect spring contacts to substrate, then electrical connection is achieved, but manufacturing yield decreases
Solution Approach 1:
The patent extracts and eliminates the problematic electroplating and seed layer formation processes from the manufacturing flow. Instead of using traditional multi-step electroplating methods, the invention directly forms conductive through-holes in the substrate and inserts spring contact elements, removing unnecessary intermediate layers and processes while maintaining electrical connectivity.
Solution Approach 2:
The patent applies preliminary action by pre-forming the spring contact elements with integrated conductive features before insertion. The spring contacts are prepared in advance with their electrical connection capabilities built-in, eliminating the need for post-insertion electroplating or seed layer formation, thereby improving manufacturing yield and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing of connectors by allowing direct electrical connection between the pin and the conductive through hole, enhancing yield and reducing production costs while maintaining reliable electrical contact.
Implementation Method 1
The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole
Data Source
AI summary
A connector includes a substrate, a coverlay and a spring contact. The substrate has a first surface, a second surface opposite to the first surface and a conductive through hole extending between the first and second surfaces. The coverlay is disposed on the first surface and includes a first opening. The spring contact includes an anchor member, a rising member and a pin. The anchor member is disposed between the substrate and the coverlay. The rising member extends from the anchor member and through the first opening in a direction away from the substrate. A first portion of the rising member is in the first opening, and a second portion of the rising member is out of the first opening. The pin extends from the anchor member to an inside of the conductive through hole, and is electrically connected to the conductive through hole.