Spring-Loaded Cooling Mass for Low Insertion Force Hot-Swappable Interfaces
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Solution Overview
Problem
High-performance data center computing systems face challenges in thermal management due to increasing power consumption and the need for efficient cooling solutions that allow for quick and easy insertion/removal of components in hot-swappable interfaces without compromising thermal resistance.
Innovation Solution
A liquid cooling system with a spring loading mechanism and thermally conductive materials is integrated into the hot-swappable interface, enabling low thermal resistance and easy component installation/removal through a lever arm or torsion spring mechanism, which applies a high loading force with minimal insertion force, ensuring efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid cooling system is integrated into the hot-swappable interface to maintain low thermal resistance, then thermal management effectiveness is improved, but the complexity of the device increases
Solution Approach 1:
The patent merges the electro-mechanical connector and liquid cooling system into a single integrated interface. The cooling channels are formed within the connector housing itself, and the heat spreader is thermally coupled to both the component and the cooling fluid pathway. This integration eliminates the need for separate cooling assemblies, reducing overall device complexity while maintaining effective thermal management.
Solution Approach 2:
The connector is designed to perform multiple functions simultaneously: electrical connection, mechanical retention, and thermal management. The same structural elements that provide electrical contacts and mechanical engagement also serve as heat dissipation pathways. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity while improving thermal management effectiveness.
2Temperature
If a spring loading mechanism is used to maintain thermal contact, then thermal resistance is reduced, but the force required for insertion increases
Solution Approach 1:
The patent employs a dynamic spring loading mechanism that automatically adjusts the contact force between the heat spreader and the component. The spring applies continuous pressure to maintain optimal thermal contact without requiring excessive insertion force. The dynamic nature of the spring allows it to compensate for manufacturing tolerances and component variations, maintaining low thermal resistance while keeping insertion forces at acceptable levels.
3Temperature
If thermal interface material is applied to the heat spreader to fill air gaps, then thermal resistance is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent modifies the surface parameters of the heat spreader by applying a thermal interface material that fills air gaps and irregularities. This material layer changes the thermal contact parameters, improving heat transfer efficiency. The manufacturing process incorporates this material application as a standard step, and the material is selected to balance thermal performance with ease of application and curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective thermal management by maintaining low thermal resistance between components and the cooling system, allowing for hundreds of insertion/removal cycles with minimal force, thus addressing the cooling challenges in high-power, high-performance computing environments.
Implementation Method 1
a spring element, which provides a loading force to a heat spreader
Implementation Method 2
a heat spreader positioned against a surface of the component and thermally coupled to a cold plate
Data Source
AI summary
An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.