Substrate-Free Spring Interconnect for Electronic Subsystems

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Solution Overview

Problem

Existing electronic and electromechanical systems face challenges in modularity, rework, and size constraints due to limitations in interconnect technologies, particularly in high-value, low-volume applications where integration density, size, weight, performance, and cost are critical, and current methods like chip-stacking and solder joints are inefficient for achieving compact, high-performance systems.

Innovation Solution

The development of substrate-free, interconnected electronic mechanical structural systems that eliminate unnecessary substrates, allowing for direct mechanical and electrical interconnection of heterogeneous and monolithic components using features like slots, protrusions, and spring fits, enabling efficient communication and alignment without the bulk of traditional substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If traditional substrates and interconnect technologies are used, then mechanical support and electrical connection are provided, but size, weight, and material usage increase unnecessarily

Engineering Contradiction:

Improvesystem weightVSAvoidinterconnection structure complexity

Core Design Contradiction:

Weight of moving objectVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the traditional substrate from the electronic system architecture. Components are directly interconnected through mechanical features (protrusions, slots, tabs) without requiring a separate substrate layer, thereby removing unnecessary material while maintaining structural support and electrical connection functions

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the functions of mechanical support, electrical connection, and component mounting into a single integrated structure. The interconnect structure combines mechanical fastening features with electrical contact points, eliminating the need for separate substrate and connector components

Inventive Principle:

Principle #5Merging (Combining)

2Loss of substance

If substrate-free interconnection is implemented, then material usage is reduced, but alignment precision and mechanical stability become challenging

Engineering Contradiction:

Improvematerial usageVSAvoidalignment precision

Core Design Contradiction:

Loss of substanceVSManufacturing precision

Solution Approach 1:

The patent incorporates preliminary alignment features directly into the interconnect structure, such as precision-machined protrusions and slots that guide component positioning before final assembly. These pre-built alignment features ensure accurate positioning without requiring additional alignment steps or materials

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces traditional mechanical alignment methods (such as substrate-based positioning or separate alignment fixtures) with integrated mechanical features built directly into the interconnect structure, including precision-machined geometric features that provide self-alignment during assembly

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of repair

If modular subsystems are used, then rework and replacement become easier, but interconnection complexity and assembly difficulty increase

Engineering Contradiction:

Improverework capabilityVSAvoidinterconnection complexity

Core Design Contradiction:

Ease of repairVSDevice complexity

Solution Approach 1:

The patent divides the electronic system into modular subsystems that can be independently manufactured, tested, and replaced. Each subsystem includes integrated interconnection features that enable simple attachment and detachment, facilitating easy rework and replacement without affecting other modules

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent designs universal interconnection features that can be used across multiple subsystems and applications. The standardized protrusions, slots, and electrical contacts provide consistent mechanical and electrical interfaces, simplifying assembly and enabling interchangeability of components

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces unnecessary material, improves alignment and interconnection precision, and allows for compact, high-performance systems with enhanced modularity and rework capabilities, addressing the limitations of existing technologies in size, weight, and thermal management.

Implementation Method 1

a spring or tapered fit or stepped interference fit to justify and align the first electronic subsystem within the slot of the second electronic subsystem

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS9306254B1Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration

Publication Date: 2016.04.05 NUVOTRONICS INC

AI summary

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.