Spring-Lead Semiconductor Package for Low-Inductance Signal Contact
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing inductance of signal terminal wiring, which can increase with methods like wire bonding and lead to inefficiencies in assembly and design, and may compromise reliability and versatility.
Innovation Solution
The semiconductor device employs a flexible lead structure with a spring portion that allows pressure contact between the signal terminal and internal circuit, eliminating the need for additional bonding processes and reducing inductance by using a simple wiring structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to connect signal terminal to internal circuit, then electrical connectivity is achieved, but inductance of signal terminal wiring increases
Solution Approach 1:
The patent extracts the harmful intermediate bonding process (wire bonding) and replaces it with a direct lead structure. The lead extends continuously from the signal terminal to the internal circuit without requiring separate bonding operations, thereby eliminating the additional inductance introduced by wire bonding while maintaining electrical connectivity.
Solution Approach 2:
Instead of using a rigid fixed structure followed by bonding, the patent inverts the approach by using a flexible lead that can adapt its position. The lead's flexibility allows it to naturally conform to the assembly, eliminating the need for bonding processes that would otherwise be required to achieve connectivity, thus reducing inductance.
2Ease of manufacture
If flexible lead structure with spring portion is used, then assembly is facilitated and inductance is reduced, but manufacturing precision of contact portion may be compromised
Solution Approach 1:
The patent applies dynamics by making the lead flexible rather than rigid. The lead includes a spring portion that allows dynamic adjustment during assembly, enabling the contact portion to automatically position itself correctly through elastic deformation. This dynamic capability facilitates assembly while maintaining sufficient manufacturing precision through self-adjustment.
Solution Approach 2:
The patent changes the physical parameters of the lead by introducing a spring portion with specific elastic properties. This parameter change allows the lead to exhibit both flexibility for easy assembly and sufficient stiffness to maintain precise contact positioning. The spring constant and geometric parameters are optimized to balance these requirements.
3Device complexity
If simple wiring structure is used to reduce inductance, then device complexity is reduced, but reliability of electrical connection may be compromised
Solution Approach 1:
The patent uses a flexible lead structure that acts as a compliant electrical connector. The flexibility of the lead allows it to absorb assembly tolerances and maintain reliable contact without requiring complex rigid positioning structures. The spring portion provides continuous contact force, ensuring reliable electrical connection while keeping the overall wiring structure simple.
Solution Approach 2:
The lead structure serves itself by using its own elastic properties to ensure reliable connection. The spring portion automatically generates contact force and maintains electrical connection without requiring additional fastening mechanisms or complex assembly procedures. This self-service capability ensures reliability while maintaining simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach facilitates assembly, reduces manufacturing costs, enhances reliability, and allows for more compact design while maintaining electrical connectivity, thus minimizing parasitic inductance and resistance.
Implementation Method 1
The lead includes a contact portion that is in contact with the electrode when the matching part is attached to the case part, a first portion connecting between the signal terminal and the contact portion, and a spring portion between the first portion and the contact portion.
Data Source
AI summary
According to one embodiment, a semiconductor device includes a semiconductor circuit having an electrode on a first surface. A case part surrounds the semiconductor circuit. A matching part is provided including a signal terminal on an outside of the matching part and a lead on the inside of the matching part that is electrically connected to the signal terminal. The case part and matching part are configured to engage one another and be attached to one another when pressed together. The lead includes a contact portion that is in contact with the electrode when the matching part is attached to the case part, a first portion connecting between the signal terminal and the contact portion, and a spring portion between the first portion and the contact portion.