Spring-Supported Leads for Semiconductor Module Height Adjustment

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Solution Overview

Problem

Semiconductor device modules face challenges with warping of application boards leading to varying distances between semiconductor device packages and heatsinks, which can result in solder damage during external loading attempts to achieve level alignment.

Innovation Solution

The implementation of semiconductor device modules with spring-supported leads and thermally conductive interface layers between the semiconductor device packages and an external heatsink, where recesses in the leads enhance the spring function to maintain even levels and reduce the risk of solder damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If external loading action is applied to achieve level alignment of semiconductor device packages, then the alignment precision is improved, but the reliability deteriorates due to increased risk of solder damage

Engineering Contradiction:

Improvealignment precisionVSAvoidsolder integrity

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

The leadframe leads are designed with spring characteristics, transforming them from rigid static components to dynamic components that can elastically deform. This allows the leads to automatically adjust and compensate for height differences caused by PCB warping, achieving level alignment without requiring external loading actions that could damage the solder joints

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent changes the mechanical parameter of the leads by introducing spring characteristics through specific geometric designs (U-shapes, V-shapes, zigzag patterns). This parameter change enables the leads to exhibit elastic deformation behavior, allowing them to absorb height variations and maintain reliable electrical connections without transmitting damaging forces to the solder joints

Inventive Principle:

Principle #35Parameter changes

2Strength

If rigid leads are used to maintain structural stability, then the strength is improved, but the adaptability deteriorates due to inability to compensate for height variations

Engineering Contradiction:

Improvestructural strengthVSAvoidheight compensation capability

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The leadframe structure combines rigid and flexible elements to create a composite mechanical system. The leads possess both structural strength for supporting electrical connections and spring characteristics for absorbing height variations, achieving a balance between strength and adaptability through integrated design

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively compensates for height differences caused by warping, ensuring even alignment of semiconductor device packages and heatsinks, minimizing the risk of solder damage and maintaining efficient heat dissipation through spring-supported leads and thermally conductive interface layers.

Implementation Method 1

a leadframe comprising a plurality of spring supported leads

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

one or more thermally conductive interface layers disposed between the semiconductor device package and the heatsink

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20230035550A1Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height Adjustment

Publication Date: 2023.02.02 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor device module includes an application board, a plurality of semiconductor device packages disposed on the application board, each one of the semiconductor device packages including a semiconductor die, a leadframe including a plurality of leads, the leads including a spring support and a heat dissipation element, and an encapsulant embedding the semiconductor die and first portions of the leads, an external heatsink, and one or more thermally conductive interface layers disposed between the semiconductor device package and the heatsink.