Spring-Loaded Cold Plate Mounting for Server Liquid Cooling

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Solution Overview

Problem

Existing cold plate designs for liquid cooling systems in data centers face challenges in achieving proper mounting pressure on processors without causing damage, and efficient assembly and disassembly without tools.

Innovation Solution

A mechanical design featuring mounting pins and brackets that allow for easy assembly and disassembly of cold plates onto processors, with springs providing optimal pressure for full contact and heat transfer, ensuring the cold plate is securely attached without damaging the processor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If mounting pressure is increased to ensure full contact between cold plate and processor, then heat transfer performance is improved, but risk of processor damage increases

Engineering Contradiction:

Improveheat transfer performanceVSAvoidprocessor damage risk

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent employs a spring-loaded mounting mechanism that provides dynamic, adjustable pressure rather than fixed rigid contact. The spring constant is specifically selected to provide optimal mounting pressure that ensures full contact between the cold plate and processor surface while automatically limiting the maximum force to prevent processor damage. This dynamic system adapts to surface variations while maintaining safe operational pressure levels.

Inventive Principle:

Principle #15Dynamics

2Reliability

If traditional mounting methods are used to secure cold plate, then reliable contact is achieved, but assembly and disassembly require tools and time

Engineering Contradiction:

Improvecontact reliabilityVSAvoidassembly and disassembly time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The mounting mechanism is segmented into modular components including the cold plate, mounting bracket, and spring-loaded pins that can be independently assembled and disassembled. This segmentation allows the cold plate to be quickly attached and removed from the processor without requiring tool intervention, while the spring mechanism maintains reliable contact pressure throughout operation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The spring-loaded mounting pins provide self-adjusting pressure and self-locking functionality that maintains reliable contact without requiring external tools for adjustment or securing. The mechanism automatically engages and disengages through simple manual operation, eliminating the need for specialized tools while ensuring consistent mounting pressure.

Inventive Principle:

Principle #25Self-service

3Productivity

If cold plate is securely mounted to ensure full contact, then cooling efficiency is improved, but assembly complexity increases

Engineering Contradiction:

Improvecooling efficiencyVSAvoidassembly complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The mounting bracket integrates multiple functions into a single component: it provides structural support for the cold plate, incorporates the spring-loaded mounting pins for pressure application, and includes alignment features for precise positioning. This merging of functions reduces the number of separate components and simplifies the overall assembly process while maintaining effective cooling contact.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables efficient heat removal by ensuring full contact between the cold plate and processor, maintaining optimal pressure to prevent damage while allowing for tool-free assembly and disassembly, thus improving cooling performance and extending server reliability.

Implementation Method 1

Cooling liquid is distributed through the cold plate to exchange heat generated from the processor

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 2

The cold plate should be fully in contact with the processor to enable the cold plate to function properly

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

A spring is compressed to provide a mounting pressure to push the cold plate to contact a surface of a processor

Methodology Applied

Scientific EffectElastic force: Elasticity

Data Source

PatentUS10485143B2Cold plate assembly for server liquid cooling of electronic racks of a data center

Publication Date: 2019.11.19 BAIDU USA LLC

AI summary

A cooling module assembly includes a cold plate to be positioned adjacent to an exterior surface of a processor to receive heat radiated from the processor, and a cold plate mounting bracket attached to the cold plate to mount the cold plate onto the processor. The cold plate mounting bracket includes a first set of mounting slots to be aligned with a second set of mounting slots disposed on a processor mounting bracket that mounts the processor. Each of the mounting slots in the first set and the second set is configured in an asymmetric shape. The first and second sets of mounting slots allow a mounting pin to be inserted through in a first angle and to rotate from the first angle to a second angle after the insertion to interlock the cold plate with the exterior surface of the processor with proper mounting pressure loaded.