Spring-Loaded Component Cooler for Stable IC Thermal Contact
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Solution Overview
Problem
Existing cooling solutions for computing devices, such as heat sinks and fluid cooling systems, struggle to efficiently remove heat from high-power integrated circuits (ICs) due to inadequate thermal contact and reliance on ambient air cooling.
Innovation Solution
The component cooler employs multiple heat pipes to distribute heat through multiple conduction paths and incorporates thermoelectric coolers (TECs) for sub-ambient cooling. Spring mechanisms are used to apply force to heat transfer elements, ensuring effective thermal contact with heat-generating components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If spring mechanisms are used to apply force to heat transfer elements, then thermal contact is improved, but device complexity increases
Solution Approach 1:
The cooling device is divided into modular components including multiple heat transfer elements (cold plates), individual spring mechanisms for each element, and a manifold system. This segmentation allows each component to be optimized independently while maintaining overall system performance and thermal contact reliability.
Solution Approach 2:
The spring mechanisms are designed to automatically apply and maintain appropriate force on the heat transfer elements without external control systems. The springs self-adjust to maintain thermal contact, eliminating the need for complex active control mechanisms while ensuring reliable thermal coupling.
2Productivity
If multiple heat pipes are used to distribute heat, then heat removal efficiency is improved, but device complexity increases
Solution Approach 1:
The heat removal function is segmented into multiple parallel heat pipes distributed across the heat transfer elements. Each heat pipe independently conducts heat from specific high-heat-generation areas to the manifold, enabling scalable heat removal capacity without requiring a monolithic complex cooling structure.
Solution Approach 2:
The heat pipes serve multiple functions simultaneously: they conduct heat from localized hot spots, distribute thermal load across the cooling system, and interface with the manifold for centralized fluid distribution. This multi-functionality reduces the need for separate dedicated components for each function.
3Temperature
If thermoelectric coolers are used for sub-ambient cooling, then temperature control is improved, but use of energy increases
Solution Approach 1:
Thermoelectric coolers are selectively applied only at specific locations where sub-ambient cooling is required, rather than cooling the entire system uniformly. This localized approach achieves precise temperature control at critical hot spots while minimizing overall energy consumption compared to system-wide cooling.
Solution Approach 2:
The system dynamically adjusts the operating parameters of the thermoelectric coolers based on real-time thermal conditions and cooling demands. By varying current levels and activation states of individual TECs, the system achieves optimal temperature control while minimizing energy consumption through adaptive parameter adjustment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides enhanced heat removal efficiency by maintaining consistent thermal contact and utilizing sub-ambient cooling, thereby improving the performance and reliability of computing devices.
Implementation Method 1
The component cooler employs multiple heat pipes to distribute heat through multiple conduction paths
Implementation Method 2
distribute heat through multiple conduction paths
Implementation Method 3
Spring mechanisms are used to apply force to heat transfer elements, ensuring effective thermal contact
Implementation Method 4
incorporates thermoelectric coolers (TECs) for sub-ambient cooling
Data Source
AI summary
An apparatus for component cooling includes a manifold and a heat transfer element configured to be thermally coupled to a heat-generating component. The apparatus further includes a first spring mechanism between the manifold and the heat transfer element. The first spring mechanism is configured to apply a first force to the heat transfer element.