Spring-Loaded Cooling Pad for Double-Sided SiP Sputtering
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Solution Overview
Problem
Double-sided system-in-package (SiP) devices face challenges during sputtering due to inadequate cooling, leading to elevated temperatures and increased likelihood of manufacturing defects, as the existing cooling mechanisms fail to effectively extract thermal energy from both sides of the package.
Innovation Solution
A cooling pad with movable pins is introduced, where the pins are spring-loaded and extend through a fluid pathway to establish direct thermal contact with the package, allowing for efficient heat transfer and maintaining the package temperature below 150-200°C by using a cooling fluid such as water, chemical coolant, or refrigerant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a traditional cooling pad is used for single-sided packages, then cooling is effective for bottom-contact devices, but cooling is inadequate for double-sided SiP devices where components block thermal contact
Solution Approach 1:
The cooling pad is segmented into multiple independent cooling zones with individual pins that can contact different locations on the package bottom surface. This allows thermal contact at multiple discrete points rather than requiring a continuous flat contact surface, enabling effective cooling even when components block partial contact areas.
Solution Approach 2:
The cooling approach transitions from a two-dimensional flat contact surface to a three-dimensional array of protruding pins. This vertical dimension allows the cooling elements to reach through gaps between components and establish thermal contact with the substrate, bypassing the blocking effect of surface-mounted components.
2Manufacturing precision
If the package temperature is kept below 150-200°C during sputtering, then manufacturing defects are reduced, but the cooling mechanism must be complex enough to extract heat from both sides of the package
Solution Approach 1:
The spring-loaded pins automatically adjust their contact pressure and position based on the package geometry and component layout. The springs provide self-regulating force that maintains optimal thermal contact without requiring complex control systems, thereby achieving effective cooling with relatively simple mechanics.
Solution Approach 2:
The cooling system utilizes variable spring forces and adjustable pin positions to adapt to different package configurations. By changing the mechanical parameters (spring constant, pin length, contact pressure), the same cooling pad structure can effectively cool various double-sided SiP device layouts without requiring complete redesign.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cooling pad with movable pins effectively maintains the package temperature within the desired range, reducing the risk of manufacturing defects by ensuring uniform and enhanced thermal energy extraction from both sides of the SiP device during the sputtering process.
Implementation Method 1
the pins are spring-loaded and extend through a fluid pathway to establish direct thermal contact with the package, allowing for efficient heat transfer
Implementation Method 2
Cooling pad 70 is made of a flexible material to tightly adhere to the bottom surface of substrate 32. Cooling pad 70 withdraws thermal energy through substrate 32 to keep package 30 below a desired target temperature
Implementation Method 3
The shielding layers are commonly formed by sputtering, which generates a significant amount of heat. Package 30 is bombarded with metal molecules 74, e.g. copper, within sputtering machine 72 to build up a conductive shielding layer 80.
Data Source
AI summary
A semiconductor manufacturing device has a cooling pad with a plurality of movable pins. The cooling pad includes a fluid pathway and a plurality of springs disposed in the fluid pathway. Each of the plurality of springs is disposed under a respective movable pin. A substrate includes an electrical component disposed over a surface of the substrate. The substrate is disposed over the cooling pad with the electrical component oriented toward the cooling pad. A force is applied to the substrate to compress the springs. At least one of the movable pins contacts the substrate. A cooling fluid is disposed through the fluid pathway.