Spring-Loaded Cup Heatsink Mounting for Low-Profile Blade Servers
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Solution Overview
Problem
Existing heat dissipation methods for electronic components in densely packed systems, such as printed circuit boards, face challenges in efficiently transferring heat due to space constraints and the need for effective thermal management without relying on complex or expensive liquid cooling systems.
Innovation Solution
A heat dissipating apparatus comprising a heat sink secured to a support member using a spring-loaded screw and drop-down cup configuration, which allows for closer mounting to the PCB while maintaining thermal contact and electrical connections, utilizing thermally conductive materials and potentially incorporating heat pipes for enhanced heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a heat sink is mounted close to the PCB to meet height constraints, then the profile is reduced, but thermal contact and fastening reliability become difficult to maintain
Solution Approach 1:
The patent employs spring-loaded fasteners that provide dynamic, compliant pressure to maintain reliable thermal contact between the heat sink and the heat-generating component. The spring mechanism automatically compensates for manufacturing tolerances and component variations, ensuring consistent thermal coupling even in low-profile configurations where rigid fastening would be difficult.
Solution Approach 2:
The patent introduces a compliant intermediary layer (such as a spring element or compliant mounting structure) between the heat sink and the component to maintain reliable thermal contact. This intermediary compensates for the reduced mounting height by providing elastic deformation capability, allowing the heat sink to remain in firm contact with the heat source despite the constrained profile height.
2Adaptability or versatility
If multiple heat-generating components are mounted on a PCB, then functionality increases, but heat dissipation becomes more complex
Solution Approach 1:
The patent designs a universal heat sink mounting system that can accommodate multiple heat-generating components on a PCB through standardized cup structures and fastener configurations. The same basic mounting mechanism (cup + spring-loaded fastener) serves multiple components simultaneously, reducing overall system complexity despite handling multiple heat sources.
Solution Approach 2:
The patent divides the heat dissipation system into modular segments, with individual heat sinks and cup structures for each heat-generating component. This segmentation allows each component to be cooled independently while using the same standardized mounting approach, managing the complexity of multiple heat sources through modular, repeatable units.
3Ease of manufacture
If conventional fastening devices are used for heat sink mounting, then ease of manufacture is maintained, but even pressure distribution across the heat sink base is difficult to achieve
Solution Approach 1:
The patent changes the pressure application parameter from rigid, fixed-position fasteners to compliant, spring-loaded fasteners that can deform elastically. This parameter change allows the fastening system to accommodate manufacturing variations in component flatness and heat sink base geometry while maintaining uniform pressure distribution across the thermal interface.
Solution Approach 2:
The patent implements local quality by allowing each fastening point to independently adjust its pressure through spring compliance. Each location on the heat sink base can exert the appropriate local pressure needed for optimal thermal contact, accommodating variations in surface flatness and component geometry while maintaining overall manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat transfer and maintains electrical connections, allowing for effective cooling of heat-emitting components even under height constraints, ensuring consistent and improved thermal management within compact electronic systems.
Implementation Method 1
at least one spring-loaded screw
Implementation Method 2
pressing a first heat sink into thermal contact with a heat emitting component
Implementation Method 3
The heat sink fins greatly increase the heat transfer area to the surrounding atmosphere and reduce the thermal resistance between the heat source and heat sink. Typically, the surrounding air circulates over the heat sink fins by convection
Implementation Method 4
Heat pipes provide a thermally efficient conduit for transferring heat from small areas of high heat generation uniformly throughout the heat sink in order to create a nearly isothermal surface on the heat sink
Data Source
AI summary
An apparatus for dissipating heat in a computer system includes a heat sink, at least one fastener which secures the heat sink to at least one first support member, and at least one cup. The first support member has a top side and a bottom side. The at least one cup includes a cylindrical cavity, an upper protruding lip, and a lower base having a hole through which the at least one fastener passes. A method for dissipating heat in a computer system includes, mounting a heat emitting component onto a printed circuit board, pressing a heat sink into thermal contact with a heat emitting component, inserting a cup into an aperture of the heat sink, and supporting a heat sink.