Spring-Loaded Heat Spreader for Memory Module Cooling
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Solution Overview
Problem
Heat removal from computing systems, particularly exascale systems, is challenging due to space limitations, cost constraints, performance limitations, scaling issues, and service and warranty restrictions, especially for tightly spaced memory modules like DIMMs on printed circuit assemblies.
Innovation Solution
A cooling system for memory modules mounted in parallel on a printed circuit board, featuring coolant tubes installed between adjacent modules and thermally conductive heat spreaders with spring-loaded fins that provide contact pressure for effective thermal coupling, allowing for efficient heat transfer and flexible installation to accommodate different power consumption expectations and module thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If memory modules are tightly spaced on printed circuit assemblies, then space utilization is improved, but heat removal becomes difficult
Solution Approach 1:
The cooling system transitions from planar cooling to three-dimensional cooling by placing heat spreaders between adjacent memory modules in the vertical dimension. This allows heat to be removed from the lateral surfaces of memory modules, effectively utilizing the vertical space between tightly packed modules rather than requiring additional horizontal space.
Solution Approach 2:
The heat spreaders are nested between adjacent memory modules, fitting into the vertical space between them. This nested arrangement allows the cooling system to operate within the existing tight spacing without requiring additional space, as the heat spreaders are positioned in the interstitial region between modules.
2Temperature
If cooling systems are installed between tightly spaced memory modules, then heat removal is improved, but space limitations prevent installation
Solution Approach 1:
The solution moves the cooling system into the vertical dimension by positioning heat spreaders between adjacent memory modules rather than requiring horizontal space. This dimensional transition allows effective heat removal while working within the constrained horizontal footprint of tightly packed memory modules.
3Temperature
If spring-loaded fins are used to provide contact pressure, then thermal coupling is improved, but device complexity increases
Solution Approach 1:
The spring-loaded fins automatically adjust and maintain optimal contact pressure with the memory modules through their inherent elastic properties. This self-regulating mechanism eliminates the need for external actuators or complex control systems, achieving effective thermal coupling while keeping the overall device complexity manageable.
Solution Approach 2:
The spring-loaded fins utilize elastic deformation to provide and maintain contact pressure. By changing the physical state of the fin material from rigid to elastically deformable, the system achieves adaptive thermal coupling that compensates for manufacturing tolerances and module variations without requiring complex adjustment mechanisms.
4Ease of manufacture
If standard memory modules are used, then cost is reduced, but cooling performance may be insufficient for high power consumption
Solution Approach 1:
The cooling system enhances heat removal from standard memory modules by utilizing the vertical dimension and lateral surfaces through interleaved heat spreaders. This three-dimensional cooling approach significantly improves thermal management capability without requiring custom high-power memory modules, thereby maintaining cost effectiveness while meeting high power consumption requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maximizes heat transfer, addresses space constraints, and reduces costs by using industry-standard memory modules, while minimizing damage to thermal interfaces and maintaining service warranties, thus enhancing the cooling performance of computing systems.
Implementation Method 1
Each spring-loaded fin includes a spring force that causes the fin to be non-perpendicular to the base and, thereby, inclines or angles the fin relative to the base. The first fin has a first spring force toward a first memory module of the adjacent memory modules, wherein the first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module.
Implementation Method 2
a coolant tube installed on the printed circuit board in parallel between adjacent memory modules of the plurality of memory modules
Implementation Method 3
a coolant tube installed on the printed circuit board in parallel between adjacent memory modules
Data Source
AI summary
A system for cooling memory modules mounted in parallel on a printed circuit board may include a coolant tube installed in parallel between two of the memory modules, and a heat spreader disposed in parallel between the two memory modules. The heat spreader may include a base having an outer surface thermally coupled to the coolant tube and first and second fins. The first fin has a first spring force toward a first of the two memory modules. The first spring force causes the first fin to provide contact pressure to the first memory module to thermally couple the first fin and the first memory module. The second fin has a second spring force toward a second of the two memory modules. The second spring force causes the second fin to provide contact pressure to the second memory module to thermally couple the second fin and the second memory module.