Spring-Loaded Heat Transfer Section for Cryostat Thermal Coupling
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Solution Overview
Problem
Existing cryostat systems face inefficiencies in heat transfer due to mechanical limitations and material constraints, particularly at low temperatures, where friction and dimensional changes complicate the design of thermally conductive couplings, leading to slow cooling and mechanical compatibility issues.
Innovation Solution
A device comprising a separate heat transfer section and spring section, where the spring section exerts a force to maintain efficient contact between the heat transfer section and the object being cooled, utilizing materials like copper or silver for high thermal conductivity and beryllium-copper alloys for elasticity, ensuring effective heat transfer without mechanical compatibility issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If mechanical contact or thermally conductive gas is used to form a thermally conductive coupling between the sample holder and cooling part, then heat transfer efficiency is improved, but friction and dimensional changes at low temperatures complicate the design and reduce reliability
Solution Approach 1:
The device is divided into separate functional sections: a heat transfer section forming contact surfaces and a spring section providing elastic force. This segmentation allows each part to be optimized independently - the heat transfer section for thermal conductivity and the spring section for mechanical reliability at low temperatures.
Solution Approach 2:
The invention uses materials with different thermal and mechanical properties in different sections. The heat transfer section uses highly thermally conductive materials (copper, silver) while the spring section uses elastic materials (beryllium-copper alloys) that maintain dimensional stability at cryogenic temperatures, compensating for thermal contraction.
2Stability of the object's composition
If traditional mechanical fastening methods are used to secure the sample holder, then structural stability is improved, but friction generates heat that warms the objects and reduces cooling efficiency
Solution Approach 1:
Traditional threaded fastening mechanisms are replaced with an elastic spring-based retention system. The spring section provides sufficient holding force through elastic deformation without requiring high-friction mechanical threads, thereby minimizing frictional heating while maintaining structural stability.
3Device complexity
If the same material is used for both heat transfer and spring functions, then device complexity is reduced, but no single material can provide both high thermal conductivity and sufficient elasticity at low temperatures
Solution Approach 1:
The device separates the heat transfer function and spring function into distinct sections with different materials optimized for each function, resolving the material property conflict.
Solution Approach 2:
The invention employs composite construction with different materials in different sections: highly thermally conductive materials (copper, silver) for heat transfer and elastic materials (beryllium-copper alloys) for spring functions, creating a composite structure that achieves both thermal and mechanical performance requirements.
4Loss of energy
If rigid thermally conductive couplings are used, then thermal contact is maintained, but dimensional changes at low temperatures cause mechanical compatibility issues
Solution Approach 1:
The spring section provides dynamic adaptability through elastic deformation, allowing the coupling mechanism to adjust to dimensional changes of the sample holder at different temperatures while maintaining reliable retention and thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and consistent cooling of objects within cryostats, maintaining thermal conductivity over multiple uses and accommodating various object sizes and shapes, while minimizing friction and dimensional changes, thus improving the overall cooling efficiency and mechanical compatibility.
Implementation Method 1
a spring section which is separate from said heat transfer section and which is arranged to exert on the heat transfer section a spring force pushing said contact surface in that direction in which it is intended to contact said object
Implementation Method 2
heat transfer section forming a contact surface for said object... efficient thermally conductive coupling... utilizing materials like copper or silver for high thermal conductivity
Data Source
AI summary
A device intended for cooling an object being moved within a cryostat comprises a heat transfer section forming a contact surface for said object and means for fastening the heat transfer section to a cooling structure in such a way that said contact surface remains free. The device comprises a spring section which is separate from said heat transfer section and which is arranged to exert on the heat transfer section a spring force pushing said contact surface in a direction in which it is intended to contact said object.