Spring-Loaded Thermal Bridge Assembly for Low-Height Heat Transfer
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Solution Overview
Problem
Existing thermal management systems face inefficiencies in heat dissipation due to limited thermal interface areas, surface variations, and increased system height, leading to degraded performance and potential component damage.
Innovation Solution
A thermal bridge assembly comprising upper and lower bridge assemblies with compressible plates and a spring element, allowing for conformal contact and enhanced thermal transfer between electrical components and heat transfer devices, while minimizing overall height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional heat sinks are used with thermal interfaces, then heat dissipation is achieved, but thermal efficiency decreases due to limited interface area and surface variations
Solution Approach 1:
The patent transitions from traditional point-contact or small-area thermal interfaces to a multi-plate stacked configuration that expands the thermal interface into multiple dimensional layers. The upper and lower bridge assemblies with multiple transfer plates create extensive thermal contact surfaces across vertical and horizontal dimensions, effectively increasing the thermal interface area without increasing the footprint area.
Solution Approach 2:
The thermal bridge is segmented into multiple discrete transfer plates (upper transfer plates and lower transfer plates) arranged in stacks. This segmentation allows each plate to independently contact the electrical component or heat transfer device, creating multiple thermal pathways and increasing the total effective thermal interface area while accommodating surface variations.
2Loss of energy
If traditional heat sinks are used, then heat dissipation is achieved, but system height increases
Solution Approach 1:
The patent employs a nested stacked plate configuration where multiple transfer plates are arranged vertically in compact layers. The upper bridge assembly and lower bridge assembly are positioned closely together with spring elements providing compression, creating a nested structure that maximizes thermal interface area within a minimized vertical envelope, thereby reducing overall system height.
3Stability of the object's composition
If rigid thermal interfaces are used, then structural stability is maintained, but thermal contact efficiency decreases due to surface variations
Solution Approach 1:
The patent replaces rigid fixed thermal interfaces with dynamic spring-loaded connections. Spring elements are positioned between the upper and lower bridge assemblies, allowing the transfer plates to dynamically adjust their position and apply optimal contact pressure to the electrical component and heat transfer device. This dynamic mechanism accommodates surface variations and maintains consistent thermal contact despite manufacturing tolerances or thermal expansion.
Solution Approach 2:
The patent utilizes spring elements that can change their compression parameter to adapt to varying interface conditions. The spring force can be adjusted to optimize thermal contact pressure, and the spring deflection automatically compensates for surface irregularities, maintaining stable thermal transfer efficiency across different operational conditions and surface states.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal bridge efficiently transfers heat across thermal interfaces with improved contact and reduced height, enhancing system performance and preventing component degradation.
Implementation Method 1
The spring element includes an upper spring member engaging the upper transfer plates to bias the upper transfer plates with an opening force generally away from the lower transfer plates. The spring element includes a lower spring member engaging the lower transfer plates to bias the lower transfer plates with an opening force generally away from the upper transfer plates.
Implementation Method 2
The thermal bridge includes an upper bridge assembly which includes a plurality of upper transfer plates... The upper ends of the upper transfer plates configured to face and thermally couple to the heat transfer device... The sides of the lower transfer plates are configured to interface with the sides of the upper transfer plates to thermally transfer heat from the lower bridge assembly to the upper bridge assembly.
Data Source
AI summary
A thermal bridge for thermally coupling an electrical component and a heat transfer device to dissipate heat from the electrical component to the heat transfer device includes upper and lower bridge assemblies includes upper and lower transfer plates, respectively. The transfer plates have sides configured to interface to thermally transfer heat from the lower bridge assembly to the upper bridge assembly. Upper ends of the upper transfer plates face and thermally couple to the heat transfer device. Lower ends of the lower transfer plates face and thermally couple to the electrical component. Upper ends of the lower transfer plates face the heat transfer device. A spring element positioned between the bridge assemblies bias against the transfer plates with an opening force.