Spring-Loaded Thermal Strap Assembly for Aerospace Heat Dissipation

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Solution Overview

Problem

In aerospace environments, it is challenging to implement effective heat mitigation strategies for electronic devices like processors due to limited space and airflow, and variations in device manufacturing can lead to stress and damage from fixed configurations, especially when trying to manage high temperatures safely.

Innovation Solution

A thermal strap assembly with adjustable retention hardware and a spring-loaded mechanism that includes a floating thermal block and pad to manage heat transfer and apply controlled pressure, using materials like aluminum for efficient heat conduction and distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a fixed configuration heat dissipation apparatus is used, then heat dissipation is achieved, but stress and damage occur due to manufacturing tolerances and device variations

Engineering Contradiction:

Improveheat dissipationVSAvoiddevice reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The patent employs a spring-loaded mechanism that allows the heat dissipation apparatus to dynamically adjust and accommodate variations in device dimensions and manufacturing tolerances. The spring provides compliance that absorbs dimensional variations while maintaining consistent thermal contact pressure, thereby preventing stress damage to the electronic device.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The apparatus changes the pressure parameter dynamically through the spring mechanism, allowing the contact pressure between the heat dissipation element and the electronic device to self-adjust within acceptable ranges. This parameter change accommodates manufacturing tolerances and device variations without compromising either heat dissipation performance or device reliability.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If excessive pressure is applied to ensure thermal contact, then heat dissipation improves, but stress and damage to the device increase

Engineering Contradiction:

Improvethermal contactVSAvoiddevice stress

Core Design Contradiction:

TemperatureVSStress or pressure

Solution Approach 1:

The spring mechanism serves as a cushioning element that prevents excessive pressure from being applied to the electronic device. By incorporating this compliant element beforehand, the system absorbs pressure variations and maintains optimal contact pressure without causing stress damage, achieving both good thermal contact and device protection.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The spring-loaded mechanism dynamically adjusts the contact pressure parameter, ensuring it remains within the optimal range for thermal conduction while never exceeding the threshold that would cause device damage. This parameter control simultaneously achieves effective heat dissipation and stress prevention.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If mitigation strategies are implemented, then device reliability improves, but space and complexity increase

Engineering Contradiction:

Improvedevice reliabilityVSAvoidapparatus complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the heat dissipation function with the pressure control function into a single integrated apparatus. The spring-loaded heat dissipation element simultaneously performs thermal conduction and stress control, eliminating the need for separate mitigation components and reducing overall system complexity while maintaining device reliability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat dissipation apparatus is designed with multi-functionality, serving both as a thermal management component and a mechanical compliance element. The spring mechanism provides both thermal contact pressure and tolerance accommodation, making the apparatus universal in addressing multiple reliability concerns without increasing complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively manages heat dissipation and applies controlled pressure to prevent damage, ensuring reliable operation of electronic devices by maintaining temperatures below thresholds and accommodating manufacturing tolerances in constrained aerospace settings.

Implementation Method 1

The strap 102 may be used to conduct heat way from a device (e.g., a processor) that the strap 102 is applied to

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The assembly may include a spring to control a load that may be placed on the device

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 3

The block 116 is also used to provide thermal conduction between, e.g., the device and the strap 102

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2811516B1Heat dissipation device

Publication Date: 2017.10.25 HAMILTON SUNDSTRAND CORP

AI summary

An apparatus comprises a thermal block (116) coupled to an electronic device (352), a thermal strap (102) coupled to the thermal block (116), and retention hardware (230) coupled to the thermal strap (102) and configured to retain the thermal block (116) within the thermal strap (102) when the apparatus is exposed to at least one variable environmental condition.