Spring-Loaded Power Transistor Mounting for Thermal Management
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Solution Overview
Problem
In high voltage switching converters, assembling power transistors on heat sinks with sufficient force while preventing wedging issues without excessive force application is challenging, affecting thermal management.
Innovation Solution
Incorporating spring elements to press against power transistors and heat sinks, facilitating thermal contact and heat dissipation, with a cost-effective and efficient compressive force application mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If power transistors are assembled onto the PCB with careful fitting to ensure close contact with heat sinks, then thermal management is improved, but assembly difficulty increases and excessive force may be required
Solution Approach 1:
The patent introduces spring elements that provide dynamic, elastic pressing force to maintain optimal thermal contact between power transistors and heat sinks. The spring mechanism automatically adjusts to assembly variations, eliminating the need for excessive assembly force while ensuring consistent thermal contact pressure.
Solution Approach 2:
The spring elements are pre-installed on the heat sinks to automatically provide the necessary pressing force when power transistors are mounted. This self-service mechanism ensures that thermal contact is maintained without requiring the assembler to apply precise or excessive force, making the assembly process easier while maintaining thermal performance.
2Temperature
If sufficient pressing force is applied to ensure thermal contact, then heat dissipation is improved, but risk of wedging and assembly damage increases
Solution Approach 1:
The spring elements provide a dynamic pressing force that is sufficient to ensure thermal contact but distributed over time and area, reducing the risk of sudden wedging or damage during assembly. The elastic nature of springs allows for gradual force application.
Solution Approach 2:
The spring elements act as cushioning elements that are pre-positioned between the power transistors and heat sinks. They absorb assembly variations and prevent excessive localized stress, cushioning against potential wedging issues while maintaining the necessary pressing force for thermal contact.
3Device complexity
If traditional assembly methods are used without spring elements, then device complexity is reduced, but thermal contact consistency deteriorates
Solution Approach 1:
The spring elements are self-adjusting components that automatically compensate for variations in transistor and heat sink dimensions. This self-service function maintains consistent thermal contact pressure without requiring complex assembly procedures or precise manufacturing tolerances.
Solution Approach 2:
The spring elements introduce a variable pressing force parameter that can be adjusted to compensate for manufacturing tolerances in the power transistors and heat sinks. This parameter change ensures consistent thermal contact despite variations in component dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spring elements ensure effective thermal contact and heat dissipation from power transistors, improving thermal management in switched power converters while being cost-effective and requiring minimal material for production.
Implementation Method 1
at least one spring element is arranged to press against the power transistor arranged on a side of the at least one heat sink
Implementation Method 2
Thermal contact is thus established between the power transistor and the heat sink, and heat dissipation from the transistor via the heat sink is greatly facilitated
Data Source
AI summary
The present invention relates to a switched power converter including a base plate on which at least one heat sink is arranged. The converter further includes at least one power transistor arranged on a side of the at least one heat sink. Further, at least one spring element is arranged to press against the power transistor arranged on a side of the at least one heat sink and an oppositely facing side of either an adjacent heat sink or a base plate end face parallel to the at least one heat sink.