Spring-Mounted Temperature Sensor Assembly for Cooktop Surface Contact
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Solution Overview
Problem
Existing cooktops face challenges in maintaining consistent and accurate temperature measurements due to varying architectures and manufacturing constraints, making it difficult for heat sensors to maintain surface contact with the cooktop panel.
Innovation Solution
A temperature detection assembly featuring a flexible beam spring and a ball element that floats relative to a distal end, coupled with a temperature sensor, ensures maximum surface contact with the cooktop panel by adjusting to varying spacings and movements, using a spring to bias the sensor towards the panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If heat sensors are placed near the cooktop panel to measure temperature, then measurement precision is improved, but maintaining surface contact between the sensor and cooktop panel becomes difficult due to varying architectures and manufacturing constraints
Solution Approach 1:
The spring-mounted temperature sensor assembly allows dynamic adjustment of the sensor position to maintain surface contact with the cooktop panel. The spring mechanism enables the sensor to move vertically and adapt to variations in panel thickness and positioning, ensuring reliable thermal contact across different cooktop architectures and manufacturing tolerances.
Solution Approach 2:
The spring constant and pre-load force are carefully selected to optimize the contact pressure between the sensor and cooktop panel. By adjusting these mechanical parameters, the system achieves sufficient thermal contact while accommodating variations in panel dimensions and positioning, thereby maintaining measurement precision across different manufacturing batches and designs.
2Reliability
If the temperature sensor is fixed rigidly to maintain contact with the cooktop panel, then surface contact is ensured, but the system cannot accommodate varying spacings and movements resulting from different architectures and manufacturing variations
Solution Approach 1:
The spring-mounted temperature sensor assembly allows dynamic adjustment of the sensor position to maintain surface contact with the cooktop panel. The spring mechanism enables the sensor to move vertically and adapt to variations in panel thickness and positioning, ensuring reliable thermal contact across different cooktop architectures and manufacturing tolerances.
3Adaptability or versatility
If the temperature sensor is made flexible to accommodate varying positions, then adaptability is improved, but measurement precision and contact stability may deteriorate
Solution Approach 1:
The spring constant and pre-load force are carefully selected to optimize the contact pressure between the sensor and cooktop panel. By adjusting these mechanical parameters, the system achieves sufficient thermal contact while accommodating variations in panel dimensions and positioning, thereby maintaining measurement precision across different manufacturing batches and designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly maintains consistent and accurate temperature measurements despite manufacturing and operational variations, ensuring the sensor remains in maximum contact with the cooktop panel, thereby improving measurement precision.
Implementation Method 1
a beam spring (18) that includes an elongated body that is flexible. The elongated body extends from a base to a distal end
Implementation Method 2
A ball element is coupled to the distal end and floats relative to the distal end
Data Source
AI summary
A cooktop appliance includes at least one burner and a temperature detection assembly for measuring a temperature proximate the at least one burner. The temperature detection assembly includes a temperature sensor, a spring that extends from a base to a distal end defining a pocket, and a ball element. The ball element that includes a rounded shape is at least partially located in the pocket and floats relative to the pocket, and the temperature sensor is coupled to the ball element.


