Spring Pin Coaxial Interconnect for Compact MIMO RF Connections
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Solution Overview
Problem
Existing RF coaxial connectors are costly, space-consuming, and require separate connection assemblies for each connection, which is problematic in MIMO systems that need multiple connections.
Innovation Solution
A coaxial connector assembly that integrates a spring pin and dielectric medium within a conductive FEM cover, allowing multiple connections to be combined in a single assembly, minimizing cost and space while ensuring RF performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional RF coaxial connectors are used for each connection, then reliable RF connection is achieved, but cost and space footprint increase significantly
Solution Approach 1:
The patent combines multiple coaxial connection functions into a single integrated connector assembly. The connector includes multiple contact pins (center contacts and outer contact) that can simultaneously establish multiple RF connections, eliminating the need for separate connectors for each connection point. This merging approach reduces the overall footprint while maintaining reliable RF connectivity across multiple channels.
Solution Approach 2:
The connector assembly is designed to perform multiple functions within a single component. It can simultaneously provide multiple center contact connections and outer contact connections, supporting various RF signal paths (transmit, receive, isolation) through a unified structure. This multi-functionality allows the same connector to serve multiple connection purposes without requiring additional specialized connectors.
2Reliability
If separate connection assemblies are used for each RF connection, then connection reliability is maintained, but manufacturing cost and distribution cost increase
Solution Approach 1:
The invention merges multiple separate connection assemblies into a single integrated connector unit. By combining multiple contact pins, dielectric elements, and shielding structures into one manufacturable component, the patent enables economies of scale in production. This approach reduces per-unit manufacturing costs and simplifies supply chain management while maintaining the reliability of individual connections through proven connector design principles.
3Adaptability or versatility
If multiple antennas are used in MIMO systems, then system performance is improved, but the number of required connections and assemblies increases
Solution Approach 1:
The connector assembly is designed with universal multi-functionality to support MIMO system requirements. It includes multiple contact pins and outer contact structures that can simultaneously handle multiple RF signal paths needed for MIMO operations (transmit, receive, isolation channels). This allows the connector to adapt to various MIMO configurations without requiring different connector types or increasing the number of connection assemblies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal loss and optimizes RF design by integrating multiple connections into a single assembly, enhancing performance in MIMO systems.
Implementation Method 1
A spring pin RF interconnect provides a novel approach to minimize the cost and space in RF design and layout while ensuring RF performance by minimizing signal loss through the connector assembly
Data Source
AI summary
A coaxial connection assembly includes a first spring pin fixed to a first component to be connected, such as an antenna which may be a patch antenna. The assembly also includes a first contact on a circuit board for connecting to the first component by way of the first spring pin. The assembly also includes a front end module (FEM) cover for spacing apart the first component and the circuit board. The FEM cover defines a first channel through which the first spring pin extends. The FEM cover is formed from a conductive material, and the first channel contains a dielectric medium or substance.