Spring Pin Substrate Connector for Electrostatic Chuck CTE Mismatch
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Solution Overview
Problem
Substrate processing systems face issues with lateral movement due to thermal expansion mismatches between substrates and electrostatic chuck components, causing damage from rubbing and solder joint fatigue.
Innovation Solution
A substrate connector with a spring pin assembly and retention spring clip allows relative movement, preventing damage and CTE mismatch by using a conductor made of the same material as the second portion, which is soldered to the spring pin assembly and includes spacers for uniform spacing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spring pin is used to provide a fixed lateral connection to the substrate, then electrical connection is maintained, but the substrate moves laterally due to CTE thermal mismatch causing rubbing and damage
Solution Approach 1:
The spring pin is replaced with a compliant connector that includes a first contact and a second contact separated by a compliant element. This dynamic structure allows the connector to flex and accommodate lateral substrate movement while maintaining electrical connection, eliminating the rubbing damage caused by fixed rigid pins.
Solution Approach 2:
A compliant element is introduced as an intermediary between the first contact and the second contact. This intermediary component absorbs the thermal expansion mismatch and allows relative movement between the connector and substrate, preventing direct rubbing contact while maintaining electrical continuity.
2Ease of operation
If a conductor and contact made of different materials are used to allow substrate movement, then lateral movement is accommodated, but CTE mismatch between conductor and contact causes solder joint fatigue and failure
Solution Approach 1:
The conductor and the second contact are made of the same material with matching coefficients of thermal expansion. This homogeneity eliminates CTE mismatch between these components, preventing solder joint fatigue and failure while still allowing the overall connector to accommodate substrate movement through the compliant element.
3Reliability
If a rigid connector is used to maintain stable electrical connection, then connection stability is achieved, but the connector does not accommodate substrate movement causing damage
Solution Approach 1:
The rigid connector is replaced with a dynamic compliant connector structure that includes flexible elements. This allows the connector to adapt its shape and position in response to substrate movement while maintaining stable electrical connection, achieving both reliability and adaptability simultaneously.
Solution Approach 2:
The mechanical properties of the connector are changed by introducing a compliant element with appropriate flexibility. This parameter change allows the connector to transition from a rigid state to a flexible state, enabling it to accommodate substrate movement while maintaining electrical connection stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate damage from thermal expansion mismatches and extends the lifespan of the connector by allowing relative movement and using materials with matching coefficients of thermal expansion.
Implementation Method 1
A spring pin assembly defines a first contact and includes a first groove. A retention spring clip includes a body arranged in the first groove and projections extending from the body.
Implementation Method 2
The second contact is soldered to the substrate. A conductor includes an end that is arranged in the cavity and soldered to the second portion.
Implementation Method 3
A substrate such as a semiconductor wafer may be arranged on the substrate support. A substrate processing system for performing etching typically include a processing chamber with a substrate support such as an electrostatic chuck.
Data Source
AI summary
A substrate connector to provide a connection to a substrate during substrate processing includes a spring pin assembly defining a first contact and including a first groove. A retention spring clip includes a body arranged in the first groove and projections extending from the body. A second contact includes a body defining a second groove. The second contact is arranged around the first contact of the spring pin assembly. The projections of the retention spring clip extend into the second groove in the second contact.