Segmented Spring Plate Clamping Assembly for Homogeneous Force Distribution
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Solution Overview
Problem
Existing clamping assemblies for semiconductor components, particularly in high-voltage technology, face challenges in achieving homogeneous distribution of compressive force, which can lead to damage and failure, especially when using thin and brittle components.
Innovation Solution
The clamping assembly employs interconnected conical annular disk spring elements with varying spring characteristics and additional spring plates to ensure uniform force distribution across the components' surface, adaptable to different surface areas and geometries, with pressure pieces and cooling plates for enhanced contact and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Force
If mechanical elements like thread systems are used for clamping, then the clamping force can be generated, but the compressive force distribution becomes inhomogeneous
Solution Approach 1:
The pressure piece is segmented into multiple discrete clamping elements (screw elements) that independently apply force to different regions of the component arrangement. This segmentation allows each element to locally adapt to the component geometry and distribute force more uniformly across the entire pressed surface, resolving the inhomogeneity problem of conventional single-point clamping.
Solution Approach 2:
A pressure piece is introduced as an intermediary element between the clamping device and the component arrangement. This pressure piece receives the clamping force and redistributes it uniformly across multiple contact points on the components, acting as a force distribution mediator that transforms concentrated mechanical force into homogeneous compressive stress.
2Area of stationary object
If the pressed surface area increases, then more components can be clamped, but the force distribution homogeneity deteriorates
Solution Approach 1:
The pressure piece incorporates multiple distributed clamping elements that scale with the pressed surface area. As the surface area increases, additional screw elements are added to maintain the same density of force application points, ensuring that force distribution homogeneity is preserved regardless of the overall size of the component arrangement.
Solution Approach 2:
Each region of the pressure piece is equipped with locally adapted clamping elements that match the local component geometry and force requirements. This local quality approach ensures that every area of the pressed surface receives appropriate compressive force, maintaining homogeneity across the entire large surface area by addressing each local region independently.
3Productivity
If thin and brittle components like semiconductor chips are used, then device miniaturization is achieved, but the risk of damage from inhomogeneous force distribution increases
Solution Approach 1:
The pressure piece acts as a protective intermediary between the clamping mechanism and the fragile semiconductor components. It transforms the potentially damaging concentrated forces from screw elements into gentle, uniformly distributed compressive stress that protects thin and brittle components from mechanical damage while maintaining reliable electrical contact.
Solution Approach 2:
The system controls the mechanical parameters of force application by using multiple small clamping elements rather than one large force, and by distributing this force uniformly across the component surface. This parameter change from concentrated to distributed loading reduces the stress concentration that would damage brittle semiconductor components during miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures a homogeneous and adaptable compressive force distribution, reducing the risk of component damage and enhancing reliability in semiconductor assemblies by scaling with the surface area and geometry, while maintaining electrical contact and heat dissipation.
Implementation Method 1
a spring device (3) with spring elements (31) that can be loaded in a stress-absorbing manner and that transfer the compressive force in a homogeneous and adaptable manner onto the component arrangement (2)
Data Source
Figure 1~2
Figure 3~5
AI summary
The invention relates to a clamping assembly (1) having an arrangement (2) of mechanically braced components that abut each other so as to form a stack, a spring system and a clamping device for generating a mechanical compressive force on the arrangement (2) of the components. The invention is characterized in that the spring system is a spring plate (3) formed from a plurality of disc spring elements (31) that are arranged next to each other and are connected to each other. In addition, the invention relates to a submodule of a converter having at least one series circuit of power semiconductor switching units and an energy storage device arranged in a parallel circuit thereto, in which the series circuit of the power semiconductor switching units is provided in the clamping device.