Spring Plate Clamping Carrier for Semiconductor Alignment
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Solution Overview
Problem
Existing semiconductor component testing systems face limitations in efficiently aligning and holding singulated components due to complex and space-consuming clamping carriers, which restrict throughput and are not suitable for large numbers or small components.
Innovation Solution
A simplified, space-saving clamping carrier design featuring a spring plate with recesses forming receiving pockets, utilizing spring elements with different strengths to align and secure components in two directions, eliminating the need for suction heads and allowing for accurate, defined positioning of singulated semiconductor components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a known clamping carrier with spring platelets and sliding blocks is used to align components in multiple directions, then alignment precision is improved, but device complexity and space requirements increase significantly
Solution Approach 1:
The patent extracts and eliminates the complex sliding block mechanism from the known clamping carrier design. By removing this unnecessary component, the invention achieves the same alignment function with a simpler spring platelet mechanism, directly resolving the contradiction between alignment precision and device complexity
Solution Approach 2:
The spring platelets are designed to automatically perform both alignment and securing functions through their elastic deformation. The platelets self-adjust to center components in receiving pockets and hold them securely without requiring external actuation mechanisms, thereby simplifying the overall device while maintaining precision
2Manufacturing precision
If a known clamping carrier with complex construction is used to accommodate and align components, then alignment capability is improved, but the number of components that can be tested simultaneously is limited due to space requirements
Solution Approach 1:
The clamping carrier is segmented into multiple independent receiving pockets, each equipped with its own spring platelet mechanism. This modular design allows numerous components to be accommodated and aligned simultaneously across the carrier surface, increasing throughput while maintaining individual alignment precision for each component
Solution Approach 2:
The spring platelets function as flexible elastic elements that can deform to accommodate components of varying sizes. This flexibility allows the carrier to hold a larger number of components in compact arrangements, improving productivity without sacrificing alignment capability
3Reliability
If suction heads are used to secure components in receiving pockets, then holding capability is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent replaces the pneumatic suction head system with a purely mechanical spring platelet mechanism. The elastic platelets provide reliable holding capability through contact force, eliminating the need for complex pneumatic systems while maintaining secure component retention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the accurate alignment and secure holding of a large number of semiconductor components, improving throughput and making the system suitable for both singulated and strip-form components, similar to handlers used for strip testing, while reducing complexity and space requirements.
Implementation Method 1
at least two spring elements, arranged at an angle to one another, with spring forces of different strengths, so as to press the semiconductor components in two different directions against the stop elements
Data Source
AI summary
In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.