Spring Plate Mediator for Liquid Cold Plate Thermal Conduction
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Solution Overview
Problem
Existing liquid cold plate heat exchangers face inefficiencies due to manufacturing tolerances, resulting in gaps between the heat sink and cap, which hinder effective heat transfer and prevent proper sealing, limiting cooling efficiency.
Innovation Solution
A spring plate is introduced between the heat sink and cap, exerting a resilient bias to reduce or eliminate the gap, allowing for thermal conduction and maintaining a liquid-tight seal, enabling efficient heat transfer and relaxing manufacturing tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a gap is present between the heat sink and cap to accommodate manufacturing tolerances, then the cap can be properly positioned and sealed to the base, but thermal resistance increases and heat transfer efficiency decreases
Solution Approach 1:
A spring plate is introduced as an intermediary component between the heat sink and cap. The spring plate includes a first surface that contacts the cap and a second surface that contacts the heat sink, thereby mediating the thermal and mechanical interaction between these two components and enabling effective heat transfer despite the presence of a gap
Solution Approach 2:
The spring plate is designed with specific physical parameters including a thickness between 0.05mm to 0.2mm and a Young's modulus between 100GPa to 200GPa. These parameter changes allow the spring plate to maintain optimal contact pressure and thermal conductivity while accommodating manufacturing tolerances
2Reliability
If the heat sink top surface contacts the cap directly, then thermal conduction is maximized, but manufacturing tolerances cannot be accommodated and proper sealing is prevented
Solution Approach 1:
The spring plate serves as a mediator that enables thermal conduction between the heat sink and cap without requiring direct contact. It absorbs dimensional variations while maintaining thermal pathways through its conductive material structure
Solution Approach 2:
The spring plate provides a dynamic solution by allowing controlled deformation and compression to accommodate manufacturing tolerances. This dynamic capability enables the system to adapt to dimensional variations while maintaining both sealing integrity and thermal contact
3Stability of the object's composition
If conventional rigid plates are used between heat sink and cap, then structural stability is maintained, but thermal resistance increases and flexibility is reduced
Solution Approach 1:
The spring plate utilizes specific material parameters including Young's modulus between 100GPa to 200GPa and thickness between 0.05mm to 0.2mm to achieve optimal balance between structural stability and thermal conductivity, reducing thermal resistance while maintaining mechanical integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spring plate enhances heat transfer efficiency by conducting heat across the gap and allows for high-temperature joining operations like vacuum brazing, improving the overall cooling performance and manufacturing flexibility.
Implementation Method 1
the spring plate may function to transfer heat across the gap between the cap and heat sink top surface by conduction
Implementation Method 2
The spring plate is positioned between the top surface of the heat sink and the lower surface of the cap so as to exert a resilient bias on the cap and the heat sink
Data Source
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AI summary
A liquid cold plate heat exchanger includes a heat sink with a plurality of fins received in a cavity between a base plate and a cap. A spring plate may be positioned between a top surface of the heat sink, e.g., over fins of the heat sink, and a lower surface of the cap in the cavity. The spring plate may at least partially and/or completely fill a gap between the heat sink and the cap, aiding in thermal conduction between the cap and heat sink.