Spring Plate Biasing in Semiconductor Cooling Stacks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face deformation due to dimensional tolerance issues during fabrication, affecting their performance and reliability.
Innovation Solution
The semiconductor device incorporates cooling plates with coolant passages, spacers to maintain spacing, semiconductor packages on the plates, and spring plates between adjacent cooling plates to bias the packages, reducing the impact of dimensional tolerance through a stacked structure with thermal grease and screws for fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If cooling pipes are stacked with spacers to maintain spacing, then the structural stability is improved, but dimensional tolerance accumulation causes deformation
Solution Approach 1:
The patent changes the rigid spacer structure into a flexible spring plate structure, allowing the system to adapt to dimensional variations through elastic deformation rather than maintaining fixed geometric parameters, thus resolving the contradiction between structural stability and dimensional tolerance accumulation
Solution Approach 2:
The invention introduces dynamic elements (spring plates) that can flex and adapt to manufacturing variations, transforming the static rigid spacer system into a dynamic system that compensates for dimensional tolerances while maintaining structural integrity
2Manufacturing precision
If spring plates are used to bias semiconductor packages, then the effect of dimensional tolerance is reduced, but device complexity increases
Solution Approach 1:
The spring plate serves multiple functions simultaneously: it acts as a spacer, provides biasing force to compensate for dimensional tolerance, and maintains contact pressure for thermal management. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving dimensional tolerance compensation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the effect of dimensional tolerance, enhancing the stability and cooling efficiency of the semiconductor device by maintaining airtightness and optimizing the placement of semiconductor packages for improved thermal management.
Implementation Method 1
a spring plate disposed between adjacent ones of the cooling plates, the spring plate biasing the at least one semiconductor package toward the cooling plates
Data Source
AI summary
An object of the present invention is to provide a semiconductor device in which the effect of dimensional tolerance can be reduced, and a method for manufacturing the same. The semiconductor device according to the present invention includes: a plurality of cooling plates each having a coolant passage inside; spacers disposed to stack the cooling plates with spaces; at least one semiconductor package disposed on at least one principal surface of at least one of the cooling plates; and a spring plate disposed between adjacent ones of the cooling plates, the spring plate biasing the at least one semiconductor package toward the cooling plates.