Spring Pressure Plate Assembly for Uniform Substrate Heat Transfer

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Solution Overview

Problem

Conventional substrate support assemblies suffer from non-uniform heat transfer characteristics and serviceability issues, leading to inconsistent thermal performance and increased difficulty in maintenance and refurbishment.

Innovation Solution

A substrate support assembly with an integrated spring pressure plate that applies equal force to a cooling plate through multiple spring elements, allowing uniform pressure and heat transfer between the cooling plate and a ceramic puck, and enabling easy assembly and disassembly without disturbing thermal interfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If conventional mechanical clamping devices are used to hold substrates, then mechanical clamping force is applied, but stress-induced cracks occur and edge areas are excluded from processing

Engineering Contradiction:

Improveclamping forceVSAvoidstress-induced cracks and edge exclusion

Core Design Contradiction:

ForceVSObject-affected harmful factors

Solution Approach 1:

The patent replaces mechanical clamping devices with an electrostatic chuck system that uses electrostatic fields to hold substrates. The electrostatic chuck includes electrodes embedded in a dielectric or semi-conductive ceramic material that generate electrostatic clamping forces without mechanical contact, eliminating stress-induced cracks and edge exclusion while maintaining effective substrate holding force.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If electrostatic chucks are used to hold substrates, then uniform substrate holding and temperature control are improved, but heat transfer uniformity between cooling plate and ceramic puck is poor

Engineering Contradiction:

Improvesubstrate temperature controlVSAvoidheat transfer uniformity

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent incorporates a spring pressure plate with multiple spring elements distributed across the cooling plate's lower surface. Each spring element applies localized pressure to specific contact points on the ceramic puck, ensuring uniform heat transfer characteristics across the entire interface while maintaining the electrostatic chuck's ability to control substrate temperature uniformly.

Inventive Principle:

Principle #3Local quality

3Device complexity

If conventional substrate support assemblies are used, then assembly is simple, but maintenance and refurbishment are difficult and time-consuming

Engineering Contradiction:

Improveassembly structureVSAvoidmaintenance and refurbishment

Core Design Contradiction:

Device complexityVSEase of repair

Solution Approach 1:

The patent designs the electrostatic chuck as a modular assembly with distinct components: a ceramic puck, a cooling plate with integrated spring pressure plate, and multiple removable fasteners. This segmentation allows individual components to be easily removed, inspected, and replaced during maintenance without disassembling the entire system, significantly improving serviceability while maintaining structural integrity during operation.

Inventive Principle:

Principle #1Segmentation

4Strength

If the cooling plate is directly coupled to the ceramic puck with fasteners, then assembly is secure, but thermal interface layers are disturbed during maintenance

Engineering Contradiction:

Improvecoupling strengthVSAvoidthermal interface preservation

Core Design Contradiction:

StrengthVSEase of repair

Solution Approach 1:

The patent introduces a spring pressure plate as an intermediary component between the cooling plate and the ceramic puck. This spring pressure plate is coupled to the cooling plate via fasteners, while the springs apply pressure to the ceramic puck through a thermal interface layer. This intermediary structure allows the cooling plate to be securely fastened while preserving the thermal interface layer between the spring pressure plate and ceramic puck, preventing disturbance during maintenance operations.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances uniformity in heat transfer characteristics, improves substrate processing accuracy, and facilitates easier maintenance by maintaining consistent thermal performance and serviceability.

Implementation Method 1

The spring pressure plate includes multiple spring elements configured to each apply an approximately equal force to the cooling plate

Methodology Applied

Scientific EffectSpring force: Spring

Implementation Method 2

a cooling plate in thermal communication with the ceramic puck

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260005056A1Substrate support assembly having an integrated spring pressure plate

Publication Date: 2026.01.01 APPLIED MATERIALS INC

AI summary

A substrate support assembly includes a ceramic puck configured to support a substrate and a cooling plate in thermal communication with the ceramic puck. The substrate support assembly further includes a spring pressure plate disposed beneath the cooling plate. The spring pressure plate includes multiple spring elements configured to each apply an approximately equal force to the cooling plate. The substrate support assembly further includes a plurality of fasteners configured to removably couple the spring plate and the cooling plate to the ceramic puck.