Spring Probe Joint Design for Rapid Assembly
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Solution Overview
Problem
Existing micro-electromechanical probe heads for spring probes are costly and time-consuming to produce due to their multi-layer planar stacked structure, which complicates assembly and increases production time.
Innovation Solution
A micro-electromechanical probe joint is created by combining a probe head with a reduced number of micro-electromechanical layers and a conductive member made through mechanical processing, allowing for simultaneous production and rapid assembly with riveting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a multi-layer planar stacked structure is used for the probe head to reduce assembly difficulty, then the assembly becomes easier, but the production cost and production duration increase significantly
Solution Approach 1:
The probe head is divided into multiple planar layers that are stacked vertically. Each layer can be manufactured separately using standard semiconductor processes, then assembled together. This segmentation allows parallel manufacturing of layers, reducing overall production duration while maintaining assembly ease through standardized interfaces between layers.
Solution Approach 2:
Multiple functional components are merged into a single integrated probe head structure through the stacked planar layers. The contact portion, main body portions, and third main body portion are combined in one assembly, eliminating the need for separate manufacturing and assembly of multiple discrete components, thus reducing production duration.
2Productivity
If the number of planar structures is reduced to lower production cost and time, then production becomes faster and cheaper, but the probe head size becomes too small for easy assembly with metal housing, spring, and plunger
Solution Approach 1:
The probe head design transitions from a two-dimensional planar structure to a three-dimensional stacked structure. By stacking multiple planar layers vertically, the probe head achieves sufficient height and complexity for easy assembly with external components while keeping each individual layer simple and fast to manufacture. This dimensional transition resolves the conflict between production speed and assembly ease.
3Strength
If micro-electromechanical technology is used to manufacture the probe head with high hardness contact end, then the contact portion achieves high hardness, but the processing and assembly difficulty increases
Solution Approach 1:
The contact portion is designed with distinct local properties - it has high hardness achieved through micro-electromechanical technology and material selection, while the main body portions use standard semiconductor processes. This local differentiation allows the critical contact area to have superior hardness without requiring the entire probe head to undergo complex micro-electromechanical manufacturing, thus reducing overall processing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production costs and time while maintaining high hardness and conductivity, enabling long-lasting, high-performance spring probes with stable low resistance and high current transmission.
Implementation Method 1
The housing 90 is further provided with a spring 93 therein, and both ends of the spring 93 contact the probe head 91 and the plunger 92, respectively, for providing a cushioning elasticity during the contact
Implementation Method 2
the probe joint is composed of a micro-electromechanical probe head and a conductive member... to ensure the firmness after assembling, which has the advantages of low production cost, short delivery time, and easy production overall in addition to the characteristic of high hardness of the micro-electromechanical probe head
Data Source
AI summary
Provided are a probe joint including a micro-electromechanical probe head and a conductive member, and a spring probe including the same. The probe head includes a docking portion extending in a radial direction to form a deformable portion; and a contact portion for contacting an object to be tested, which is located at one end of the docking portion and has a size decreasing as away from the docking portion. The conductive member has a connecting section having an extended portion surrounding to define a carrier space; and a notch which communicates with the carrier space. When assembling, the docking portion can be disposed in the carrier space, the deformable portion extends out of the connecting section through the notch. The deformable portion can be deformed and forms a deformed portion, which partially wraps the extended portion, thereby preventing the probe head from being separated from the conductive member.


