Spring-Based Semiconductor Attachment for Thermal Stress
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Solution Overview
Problem
Power electronics assemblies face issues with bond layers that are noncompliant and prone to cracking and remelting due to thermal stress, leading to inefficiencies in cooling and increased manufacturing costs due to the discarding of usable components.
Innovation Solution
A spring-based coupling apparatus is used to attach a semiconductor device to a cooling system, eliminating the need for a bond layer by employing a frame assembly with a spring assembly that provides compliance and retains the semiconductor device, allowing for effective heat flux and electrical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bond layer is used to attach the semiconductor device to the cooling system, then the components can be bonded together, but the bond layer may crack and remelt due to thermal stress from coefficient of thermal expansion mismatch
Solution Approach 1:
The patent changes the mechanical properties of the attachment system by replacing a rigid bond layer with a compliant spring-based mechanism. The spring assembly can deform elastically under thermal stress, accommodating coefficient of thermal expansion mismatch between the semiconductor device and cooling system without cracking or remelting.
Solution Approach 2:
The spring assembly acts as an intermediary element between the semiconductor device and the cooling system. It provides a compliant interface that absorbs thermal stresses, eliminating the need for a brittle bond layer while maintaining mechanical attachment and electrical/thermal connectivity.
2Device complexity
If a noncompliant bond layer is used, then the assembly structure is simple, but it cannot handle thermally induced stress effectively
Solution Approach 1:
The patent transforms the attachment system from a rigid, noncompliant structure to a compliant one by introducing spring elements. This change in mechanical compliance allows the system to accommodate thermal expansion differences while maintaining structural integrity and reliability under stress.
3Ease of manufacture
If a bond layer is used, then components can be attached, but manufacturing costs increase and components must be discarded when damaged
Solution Approach 1:
The patent segments the attachment system into separate, replaceable components: the spring assembly and the frame members. This allows the spring assembly to be replaced independently if damaged, rather than discarding the entire semiconductor device or cooling system, thereby reducing component waste and manufacturing costs.
4Reliability
If a compliant attachment method is used, then thermal stress is better handled, but the assembly structure becomes more complex
Solution Approach 1:
The spring assembly serves as a simple intermediary component that provides compliance without requiring complex multi-layer bond structures. The single-element spring mechanism achieves thermal stress resistance while maintaining relative structural simplicity compared to multiple bond layers with different compliance properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The spring-based system enhances compliance, reduces cracking and remelting issues, enables the reuse of components, and lowers assembly costs by providing a compliant interface between the semiconductor device and the cooling system.
Implementation Method 1
a spring-based device to bind components together... using a spring-based device to bind components together... provides compliance... reduces cracking and remelting issues
Data Source
AI summary
Apparatuses for coupling a semiconductor device to a cooling system, methods of coupling a semiconductor device to a cooling system, and systems incorporating the apparatuses are disclosed. An apparatus includes a first frame member coupled to the cooling system, a second frame member coupled via one or more fasteners to the first frame member, and a spring assembly disposed between the first frame member and the second frame member. The semiconductor device is disposed between the spring assembly and the second frame member.