Spring Support Tool for Semiconductor Module Fixing
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Solution Overview
Problem
Existing semiconductor devices require dedicated screws and screw through holes for fixing semiconductor modules and cooling units, which complicates the assembly process and occupies unnecessary space, while also necessitating additional components for electromagnetic noise shielding.
Innovation Solution
A semiconductor device design that laminates a semiconductor module and a cooling unit on a terminal board, using a spring member and spring support tool to secure them without dedicated screws, and incorporates a control board fixed onto the spring support tool, which also functions as an electromagnetic noise shielding member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dedicated screws and screw through holes are used to fix the semiconductor module and cooling unit, then the fixing reliability is improved, but the device complexity and component count increase
Solution Approach 1:
The spring support tool integrates multiple functions: it supports the spring member, fixes the control board, and provides electromagnetic noise shielding. This merging of functions eliminates the need for separate dedicated fixing members and shielding members, thereby reducing device complexity while maintaining fixing reliability
Solution Approach 2:
The spring support tool is designed as a multi-functional component that simultaneously serves as a support structure for the spring member, a mounting base for the control board, and an electromagnetic noise shielding member. This universal design reduces the overall component count while ensuring reliable fixing of the semiconductor module and cooling unit
2Strength
If dedicated screws and screw through holes are used to fix the semiconductor module and cooling unit, then the fixing strength is improved, but the loss of substance and space occupation increase
Solution Approach 1:
The spring support tool combines multiple components into one integrated structure, eliminating the need for separate dedicated fixing members and shielding members. This reduction in component count directly addresses the loss of substance while maintaining adequate fixing strength through the spring mechanism
Solution Approach 2:
By designing the spring support tool to perform multiple functions (supporting the spring, fixing the control board, and providing shielding), the patent reduces the total number of components required, thereby reducing material consumption and assembly complexity while maintaining necessary fixing strength
3Object-affected harmful factors
If additional electromagnetic noise shielding members are used, then the electromagnetic noise shielding effectiveness is improved, but the device complexity and component count increase
Solution Approach 1:
The spring support tool is designed to integrate electromagnetic noise shielding functionality into its structure, eliminating the need for separate shielding members. This merging of shielding function into the existing support structure reduces device complexity while maintaining effective electromagnetic noise protection for the control board
Solution Approach 2:
The spring support tool serves as a multi-functional component that simultaneously provides mechanical support, fixing capability, and electromagnetic noise shielding. This universal design eliminates the need for additional dedicated shielding members, thereby reducing device complexity while maintaining effective electromagnetic interference protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, reduces component count and size, and effectively shields electromagnetic noise without the need for additional shielding members, while allowing for efficient cooling of both the semiconductor module and capacitors embedded in the terminal board.
Implementation Method 1
a spring member configured to press the semiconductor module and the cooling unit against the terminal board
Implementation Method 2
The spring support tool applies, to the spring member, an urging force for pressing the semiconductor module and the cooling unit against the terminal board
Implementation Method 3
a cooling unit configured to cool the semiconductor module
Implementation Method 4
the spring support tool is configured to function as an electromagnetic noise shielding member positioned between the semiconductor module and the control board
Data Source
AI summary
A terminal board is electrically connected to a module terminal of a semiconductor module. The semiconductor module and a cooling unit are laminated on the terminal board. A spring member is disposed on the semiconductor module and the cooling unit. A spring support tool is disposed on the spring member in order to apply, to the spring member, an urging force for pressing the semiconductor module and the cooling unit against the terminal board.