Spring-Type Temperature Sensor Array for Semiconductor Die Testing
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Solution Overview
Problem
Maintaining accurate and stable die temperature in the semiconductor TEST/SORT industry is challenging due to size and material characteristics, especially under dynamic conditions, as existing methods like IR cameras have limitations in absolute accuracy and are bulky, and physical contact methods face issues with sensor-to-sensor variation and thermal isolation.
Innovation Solution
A system using a compact array of calibrated spring-type temperature sensors with 4-wire measurement and gimbaling mounts, connected via pogo-pins to a routing PCB, which minimizes contact resistance and allows for accurate temperature profiling with high thermal coupling and minimal thermal transfer beyond the sensors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If IR cameras are used for temperature measurement, then measurement distance and accessibility are improved, but absolute accuracy deteriorates and device size increases
Solution Approach 1:
The patent introduces a transfer medium (test surface or test vehicle) that physically couples the temperature sensor array to the device under test. This intermediary enables accurate temperature measurement by providing a stable thermal interface while keeping the sensor array separate from the DUT, thus achieving both accessibility and accuracy.
Solution Approach 2:
The patent creates a thermal copy or replica of the DUT's temperature distribution by using a test surface that thermally couples to the DUT. The sensor array measures temperatures on this copy rather than directly on the DUT, enabling accurate measurement while maintaining measurement accessibility.
2Measurement precision
If physical contact temperature sensors are used, then measurement accuracy is improved, but sensor-to-sensor variation and thermal isolation issues worsen
Solution Approach 1:
The patent divides the measurement system into separate functional components: a sensor array segment that measures temperatures, a test surface segment that provides thermal coupling, and a DUT segment that generates the heat. This segmentation allows each component to be optimized independently, reducing sensor-to-sensor variation through standardized sensor mounting while maintaining thermal isolation.
Solution Approach 2:
The patent changes the thermal parameters of the test surface (thermal conductivity, thickness, material composition) to optimize the thermal coupling between the sensor array and DUT. By adjusting these parameters, the system achieves consistent thermal interfaces across multiple sensors, reducing sensor-to-sensor variation while maintaining measurement accuracy.
3Temperature
If temperature controlled surfaces are used for heat management, then temperature control capability is improved, but maintaining stable temperature under dynamic conditions worsens
Solution Approach 1:
The patent performs preliminary temperature measurements using the sensor array to characterize the thermal behavior of the DUT and test surface combination. This preliminary data is used to pre-calibrate the system and establish baseline thermal parameters, enabling faster and more accurate temperature control under dynamic conditions.
Solution Approach 2:
The patent implements a feedback control system that continuously monitors temperatures via the sensor array and adjusts the temperature controlled surface parameters accordingly. This real-time feedback enables the system to maintain stable temperatures under dynamic conditions by compensating for thermal fluctuations and maintaining the desired thermal state.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves absolute accuracy of ±0.5°C and sensor-to-sensor accuracy of ±0.25°C, with low power consumption and rapid response times, effectively addressing the challenges of maintaining stable die temperatures under dynamic conditions.
Implementation Method 1
a plurality of temperature sensors coupled to an insulator block and translatable in a first direction within the insulator block
Implementation Method 2
a plurality of compressive contact pins, each of the plurality of compressive contact pins electrically coupling a corresponding temperature sensor to the printed circuit board
Data Source
AI summary
Disclosed is a system for measuring a surface temperature. The system may comprise a printed circuit board, an insulator block, a conductive probe, a plurality of temperature sensors, and a plurality of compressive contact pins. The conductive probe may have a first surface and a second surface opposite the first surface. The conductive probe may be coupled to the insulator block. The plurality of temperature sensors may be coupled to the insulator block and translatable in a first direction within the insulator block. Translation of the plurality of temperature sensors in the first direction may cause each of the plurality of temperature sensors to contact the first surface of the conductive probe. The plurality of compressive contact pins may each be electrically couple a corresponding temperature sensor to the printed circuit board.