Power Module Circuit Board With Sputtered Thin Film Resistor
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Solution Overview
Problem
Conventional power modules have increased volume, manufacturing costs, and potential defects due to the inclusion of separate resistors and bonding agents, which are not suitable for harsh environments like high temperatures.
Innovation Solution
A power module structure with a built-in thin film resistor component, eliminating the need for separate resistors, formed by sputtering a resistor material through a mask onto a circuit board with an inclined metal pattern, allowing for minimal volume, higher reliability, and lower costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a separate resistor is disposed on the upper substrate to control parallel power semiconductors, then the power module can control multiple power semiconductors, but the volume and manufacturing cost increase
Solution Approach 1:
The patent merges the resistor function with the upper substrate by forming a resistor pattern directly on the copper foil layer of the substrate. This integration eliminates the need for separate resistor components and their associated mounting space, thereby reducing module volume while maintaining the capability to control multiple parallel power semiconductors.
Solution Approach 2:
The upper substrate is designed to serve multiple functions: it provides mechanical support, electrical connection pathways, and integrated resistive elements for controlling parallel power semiconductors. By making the substrate multi-functional, the patent eliminates the need for separate dedicated resistor components, reducing overall module volume.
2Ease of manufacture
If a bonding agent is used to bond the resistor to the upper substrate, then the resistor can be mounted, but the bonding agent may melt in high temperature processes causing product defects
Solution Approach 1:
The patent extracts the resistor from being a separate bonded component and integrates it directly into the substrate structure through pattern formation. This eliminates the bonding agent entirely, removing the source of high-temperature failure while maintaining ease of manufacture through direct patterning processes.
Solution Approach 2:
By merging the resistor with the substrate through direct pattern formation on the copper foil, the patent eliminates the interface between resistor and substrate that would require bonding agents. This integration removes the reliability issue of bonding agent melting while maintaining manufacturing simplicity.
3Adaptability or versatility
If a separate resistor is disposed on the upper substrate, then parallel power semiconductors can be controlled, but the manufacturing cost increases
Solution Approach 1:
The patent merges the resistor function with the substrate manufacturing process by forming resistor patterns directly on the copper foil layer during substrate fabrication. This integration eliminates the need for separate resistor procurement, mounting, and bonding operations, thereby reducing manufacturing cost while maintaining control capability.
Solution Approach 2:
The substrate is designed to provide multiple functions including mechanical support, electrical connections, and resistive control elements. This multi-functionality reduces the total component count and assembly steps, leading to lower manufacturing costs while maintaining the ability to control parallel power semiconductors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a power module with reduced volume, enhanced reliability, and lower manufacturing costs while enabling flexible resistor design changes.
Implementation Method 1
formed by sputtering a resistor material through a mask onto a circuit board
Data Source
AI summary
An apparatus and method for manufacturing a power module is provided. The power module includes: a circuit board having a metal pattern formed thereon; a terminal coupled to the circuit board and electrically connected to at least a portion of the metal pattern; a power device chip bonded to the circuit board and electrically connected to at least a portion of the metal pattern and the terminal; and a molding part covering the power device chip and the circuit board. The circuit board includes: a base part comprising an insulating material; a pattern layer disposed on at least one of an upper surface and a lower surface of the base part and providing the metal pattern; and a thin film resistor having a predetermined circuit pattern connecting the metal patterns disposed on the base part to each other.