Segmented Shielding for Sputtering Angle Control
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Solution Overview
Problem
Existing sputtering apparatuses lack controllability over the angle of incidence of sputtered particles onto substrates, which affects film formation uniformity and directivity.
Innovation Solution
A sputtering apparatus with a shielding member comprising a first and second plate, adjustable in the X direction, that controls the angle of incidence by adjusting the slit opening width and distance between the target and the substrate, allowing precise adjustment of sputtered particle incidence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single shielding member with a slit is used to control sputtered particle direction, then the structure is simple, but the controllability of the angle of incidence is insufficient
Solution Approach 1:
The shielding member is divided into multiple independent shielding plates (first shielding plate, second shielding plate, third shielding plate) that can be adjusted separately. Each plate has a slit and can be positioned at different angles and distances from the target, allowing independent control of sputtered particle trajectories. This segmentation enables precise adjustment of the angle of incidence while maintaining a relatively simple overall structure.
Solution Approach 2:
The shielding plates are designed to be movable rather than fixed, with each plate capable of independent angular and positional adjustment. This dynamic configuration allows the system to adapt the angle of incidence for different sputtering requirements, transforming a static simple structure into a dynamically controllable system that achieves both structural simplicity and operational versatility.
2Device complexity
If the substrate is moved in one direction only, then the mechanism is simple, but the film formation uniformity across the substrate surface is poor
Solution Approach 1:
The substrate moving mechanism is enhanced to include movement in multiple dimensions: the substrate can move not only in the horizontal direction (X-axis) but also in the vertical direction (Y-axis) and rotational direction. This multi-dimensional movement allows the substrate to be positioned at various angles and distances relative to the target and shielding plates, enabling uniform film formation across the entire substrate surface while maintaining a relatively simple mechanical structure.
3Device complexity
If the slit opening width is fixed, then the structure is simple, but the selectivity of sputtered particle incidence on different substrate regions is poor
Solution Approach 1:
The slit opening width in each shielding plate is designed to be adjustable rather than fixed. By independently adjusting the angular position and distance of each shielding plate, the effective slit opening width can be dynamically changed to control which sputtered particles reach which regions of the substrate. This enables selective film formation on specific substrate regions (such as convex parts or corner portions) while maintaining a simple slit member structure without requiring complex variable-width mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the controllability of the angle of incidence, enabling selective film formation on substrates with improved uniformity and directivity, particularly on convex parts and corner portions.
Implementation Method 1
A sputtering apparatus in which sputtered particles ejected from a target are incident on a substrate such as a wafer to form a film
Implementation Method 2
a sputtered particle ejecting section which generates sputtered particles by plasma from a pair of targets
Data Source
AI summary
There is provided a sputtering apparatus comprising: a target from which sputtered particles are emitted; a substrate support configured to support a substrate; a substrate moving mechanism configured to move the substrate in one direction; and a shielding member disposed between the target and the substrate support and having an opening through which the sputtered particles pass. The shielding member includes a first shielding member and a second shielding member disposed in a vertical direction.