Sputtering Apparatus Annular Member Tapered Surface Particle Redirection
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Solution Overview
Problem
In sputtering apparatuses, there is a challenge in preventing the adhesion of sputtered particles to the backside of substrates or substrate supports, which can affect film formation quality and electrostatic chuck performance.
Innovation Solution
The sputtering apparatus incorporates an annular member with a tapered surface at its corner portion and an edge cover to redirect rebounded sputtered particles away from the substrate's backside and support surface, preventing adhesion by creating a gap and using a magnetic functional surface to collect magnetic particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sputtering is performed with oblique incidence of sputtered atoms, then film formation quality is improved, but particles adhere to the backside of the substrate and substrate support
Solution Approach 1:
The patent extracts and removes the harmful rebounded particles from the system by providing a dedicated particle removal mechanism (wafer holder with particle removal means) that actively collects and removes particles adhering to the backside of the substrate, thereby resolving the contradiction between achieving good film quality and preventing particle contamination
Solution Approach 2:
The patent introduces an intermediary structure (edge cover and annular member with magnetic functional surface) that acts as a mediator to redirect and collect magnetic particles before they can adhere to critical surfaces, thus preventing particle contamination while maintaining the benefits of oblique sputtering
2Object-generated harmful factors
If particles are removed by a wafer holder, then particle adhesion is suppressed, but the structure becomes more complex
Solution Approach 1:
The patent merges multiple functions into the wafer holder structure: it serves as both the substrate support and the particle removal mechanism. The particle removal means is integrated into the wafer holder body, combining substrate handling and particle removal functions in a single component, thereby reducing overall system complexity while maintaining effective particle suppression
Solution Approach 2:
The wafer holder is designed with multi-functionality, serving simultaneously as a substrate support, a positioning device, and a particle removal mechanism. This universal design allows a single component to perform multiple tasks, reducing the need for additional separate parts and simplifying the overall apparatus structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses the adhesion of sputtered particles to the substrate's backside and support surface, ensuring consistent film deposition and maintaining the electrostatic chuck's attracting properties.
Implementation Method 1
the annular member has a magnetic functional surface that extends from the first surface to the second surface along an inner periphery of the annular member
Data Source
AI summary
A sputtering apparatus includes a base on which a substrate is mounted, an annular member disposed at an outer periphery of the base to surround a side surface and a backside of the substrate without in contact with the substrate, and an edge cover that covers an outer edge of an upper surface of the substrate mounted on the base. The annular member has a first surface facing the backside of the substrate mounted on the base with a gap, a second surface facing the side surface of the substrate mounted on the base with a gap, and a tapered surface formed at a corner portion between the first surface and the second surface.