Sputtering Cathode Layout for Multi-Target Film Formation
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Solution Overview
Problem
Existing film formation apparatuses face challenges in increasing the variety of targets without enlarging the cathode or the apparatus, as adding more targets requires larger processing containers and altered cathode designs that disrupt sputtering particle emission patterns.
Innovation Solution
The apparatus employs multiple cathodes with insulating members and adjustable shutters to accommodate various types of targets, allowing for simultaneous mounting of multiple targets without increasing the cathode size or apparatus dimensions, using a magnet mechanism to control target exposure and sputtering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple targets of different types are mounted in the apparatus, then the variety of targets is increased, but the cathode size and apparatus size must be enlarged
Solution Approach 1:
The cathode is divided into multiple independent cathode units, each capable of holding a different type of target. This segmentation allows multiple target types to be mounted simultaneously without requiring a larger overall cathode structure, as each unit operates independently within the existing cathode footprint.
Solution Approach 2:
Multiple targets of different types are arranged in a nested or compact configuration within the cathode units. The targets are positioned to utilize vertical and horizontal space efficiently, allowing diverse target types to coexist within the original cathode dimensions without requiring expansion.
2Adaptability or versatility
If multiple targets of different types are mounted in the apparatus, then the variety of targets is increased, but the apparatus size must be enlarged
Solution Approach 1:
The apparatus is segmented into multiple processing regions, each associated with a specific cathode unit. This allows different target types to be positioned in distinct zones within the existing apparatus volume, eliminating the need to enlarge the overall apparatus to accommodate target diversity.
Solution Approach 2:
Targets are arranged in multiple dimensions within the cathode units, utilizing vertical stacking and angular positioning rather than only horizontal expansion. This multi-dimensional arrangement enables diverse target types to fit within the original apparatus footprint by exploiting three-dimensional space efficiently.
3Adaptability or versatility
If the cathode design is altered to accommodate more targets, then the variety of targets is increased, but the sputtering particle emission pattern is disrupted
Solution Approach 1:
Each cathode unit maintains its own optimized design for generating consistent sputtering emission patterns. By segmenting the cathode into independent units, each unit can preserve its original emission characteristics while collectively accommodating diverse target types, thus avoiding disruption to the overall sputtering process quality.
Solution Approach 2:
Each cathode unit is designed with local optimizations specific to its target type, allowing each region to maintain ideal sputtering conditions. This localized design approach ensures that sputtering particle emission patterns remain consistent and controlled for each target, even while accommodating variety across different cathode units.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the simultaneous mounting of multiple target types without altering the cathode design or increasing the apparatus size, maintaining efficient sputtering conditions and reducing manufacturing costs, while allowing for flexible target replacement and minimizing downtime.
Implementation Method 1
a plurality of cathodes configured to hold targets that emit sputtered particles
Data Source
AI summary
There is provided a film formation apparatus which forms a film on a substrate by sputtering. The apparatus comprises: a substrate holder configured to hold the substrate; and a plurality of cathodes configured to hold targets that emit sputtered particles, and connected to a power supply. At least one of the plurality of cathodes holds the targets of a plurality of types.


