Magnetron Sputtering Cathode Motion for Uniform Target Erosion
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Solution Overview
Problem
Existing film forming technologies face challenges in effectively controlling target erosion during sputter film formation, leading to fluctuations in film formation performance, ignition stability, and reduced target utilization due to uneven erosion patterns, particularly in low-pressure sputtering conditions.
Innovation Solution
A film forming apparatus with a magnet driving part that oscillates and moves a cathode magnet in multiple dimensions, including perpendicular and independent directions, to control the leakage magnetic field and evenly distribute erosion across the target surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a magnet is provided on the rear side of a target to perform magnetron sputtering, then film formation efficiency is improved, but target erosion becomes uneven and difficult to control
Solution Approach 1:
The magnet is made movable relative to the target through a driving mechanism that enables scanning motion. The magnet can oscillate along the target surface and move perpendicularly to it, dynamically adjusting the magnetic field distribution to control erosion patterns and achieve uniform target consumption while maintaining high film formation efficiency
Solution Approach 2:
The magnet driving mechanism adds perpendicular motion dimension to the traditional oscillation motion. By moving the magnet in a direction perpendicular to the target surface in addition to oscillating along it, the system creates two-dimensional scanning capability that enables precise control over the magnetic field interaction area, thereby achieving uniform erosion distribution
2Manufacturing precision
If the magnet is oscillated along the target, then target erosion is controlled, but erosion uniformity remains insufficient under low-pressure sputtering conditions
Solution Approach 1:
The system employs dynamic oscillation control where the magnet's position and motion characteristics can be adjusted based on process conditions. This dynamic adjustment capability allows optimization of erosion control for different pressure conditions while maintaining stable plasma ignition and discharge characteristics
Solution Approach 2:
The magnet driving mechanism allows changing operational parameters such as oscillation amplitude, frequency, and perpendicular displacement distance. By adjusting these parameters, the system adapts to low-pressure sputtering conditions to achieve both uniform erosion control and stable ignition, resolving the contradiction between erosion control precision and ignition reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes discharge and film formation processes, enhances target utilization, and extends the target's lifespan by ensuring uniform erosion, thereby improving productivity and film quality.
Implementation Method 1
a magnet provided on a rear side of the target to apply a leakage magnetic field to the target
Implementation Method 2
Magnetron plasma is formed near the target
Implementation Method 3
high-density plasma is formed by an electric field generated by a voltage applied to the target and a magnetic field generated by the magnet
Implementation Method 4
particles sputtered from a target are deposited on a substrate
Data Source
AI summary
A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target, a power supply configured to supply electric power to the target, a magnet provided on a rear side of the target, and a magnet driving part configured to drive the magnet. The magnet driving part includes an oscillation driver configured to oscillate the magnet along the target, and a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target independently of driving performed by the oscillation driver. Sputtered particles are deposited on the substrate by magnetron sputtering.