Magnetron Sputtering Cathode with 3D Magnet Motion for Uniform Erosion
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Solution Overview
Problem
Existing film forming technologies face challenges in effectively controlling target erosion during sputtering, leading to fluctuations in film formation performance and reduced target utilization, especially under low-pressure conditions, resulting in unstable ignition and uneven film distribution.
Innovation Solution
A film forming apparatus with a magnet driving part that oscillates and moves the cathode magnet in three dimensions, allowing for precise control of the leakage magnetic field strength and distribution above the target, ensuring uniform erosion and extended target life by adjusting the magnet's position based on real-time discharge parameters and target shape analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a magnet is provided on the rear side of a target to form high-density plasma for sputtering, then film formation performance is improved, but target erosion becomes uneven and difficult to control
Solution Approach 1:
The magnet is configured to oscillate in the radial direction of the target and can be moved axially, transforming a static magnetic field system into a dynamic one. This allows the magnet to periodically change position relative to the target surface, distributing plasma density more evenly across the target and preventing localized excessive erosion while maintaining high film formation performance.
Solution Approach 2:
The magnet's oscillation in the radial direction and movement in the axial direction add dimensional control to the previously static magnetic field application. By introducing radial oscillation and axial positioning capabilities, the system achieves three-dimensional control over plasma distribution, enabling uniform target erosion while maintaining high-density plasma for effective film formation.
2Device complexity
If the magnet is stationary during sputtering, then the apparatus structure is simple, but target erosion is uneven and target life is reduced
Solution Approach 1:
The magnet is transformed from a stationary component to a dynamic one with oscillation and positioning capabilities. The oscillation driver and axial movement mechanism enable the magnet to actively control plasma distribution, preventing localized target damage and extending target life without significantly complicating the overall apparatus structure.
Solution Approach 2:
The magnet oscillates periodically in the radial direction during sputtering operation. This periodic motion creates alternating high-density plasma regions across the target surface, ensuring uniform energy distribution and preventing localized excessive erosion, thereby extending target life while maintaining relatively simple apparatus structure.
3Loss of substance
If the magnet oscillates along the target to control erosion, then target utilization is improved, but discharge stability becomes difficult to maintain
Solution Approach 1:
The magnet's radial oscillation and axial positioning are controlled dynamically to balance target utilization and discharge stability. By adjusting oscillation amplitude, frequency, and axial position based on process requirements, the system achieves uniform target erosion while maintaining stable plasma discharge conditions throughout the sputtering process.
Solution Approach 2:
The system controls discharge stability by adjusting oscillation parameters (amplitude, frequency) and axial position parameters. These parameter changes allow optimization of both target utilization and discharge stability, enabling the magnet to distribute plasma evenly across the target while maintaining consistent discharge conditions for reliable film formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution stabilizes discharge and film formation processes, improves target utilization, and extends the target's lifespan by uniformly distributing the erosion, enhancing productivity and film quality.
Implementation Method 1
a magnet provided on a rear side of the target to apply a leakage magnetic field to the target
Implementation Method 2
an oscillation driver configured to oscillate the magnet along the target
Implementation Method 3
a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target
Implementation Method 4
particles sputtered from a target are deposited on a substrate
Implementation Method 5
the sputtered particles are deposited on the substrate by magnetron sputtering
Data Source
AI summary
A film forming apparatus includes a processing container, a substrate holder configured to hold a substrate inside the processing container, a cathode unit disposed above the substrate holder, and a gas introducing mechanism configured to introduce a plasma generating gas into the processing container. The cathode unit includes a target, a power supply configured to supply electric power to the target, a magnet provided on a rear side of the target, and a magnet driving part configured to drive the magnet. The magnet driving part includes an oscillation driver configured to oscillate the magnet along the target, and a perpendicular driver configured to drive the magnet in a direction perpendicular to a main surface of the target independently of driving performed by the oscillation driver. Sputtered particles are deposited on the substrate by magnetron sputtering.