Coarse Surface Sputtering Chamber Fixtures
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Solution Overview
Problem
Conventional semiconductor sputtering equipment faces reduced yield rate and increased maintenance costs due to rapid accumulation of deposition on fixing elements and protection plates, requiring frequent cleaning and replacement, which affects equipment utilization and efficiency.
Innovation Solution
The reaction chamber design features coarse surfaces with crisscrossed trenches on target fixing elements, carrier rings, and protective rings, increasing the surface area and preventing abnormal peeling of deposition, thus extending the replacement cycle and improving equipment utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the surface of fixing elements and protection plates is made smooth with aluminum sprayed coating, then the initial yield rate is good, but the deposition accumulates rapidly and peels off after extended operation time
Solution Approach 1:
The patent applies different surface qualities to different parts of the fixing elements and protection plates. Specifically, the surfaces that contact the deposition material are treated with coarse surfaces having uneven patterns, while other portions maintain smooth surfaces. This local differentiation allows the contact surfaces to withstand deposition accumulation without peeling, extending the replacement cycle while maintaining yield rate.
Solution Approach 2:
The coarse surfaces with uneven patterns are pre-formed on the fixing elements and protection plates before operation begins. This preliminary surface treatment creates a surface structure that can accommodate deposition accumulation without peeling, allowing the components to withstand extended operation times and multiple deposition cycles before replacement is needed.
2Productivity
If the replacement cycle is extended by using coarse surfaces, then the utilization rate increases and cost decreases, but the surface area increases which may affect deposition quality
Solution Approach 1:
The coarse surface treatment is applied only to specific contact surfaces of the fixing elements and protection plates where deposition accumulation occurs, rather than the entire surface area. This localized approach extends the replacement cycle and improves utilization rate while minimizing the impact on overall surface area and deposition quality on the wafer.
3Reliability
If frequent cleaning and replacement is performed to maintain yield rate, then the quality is maintained, but the equipment utilization rate decreases and operational cost increases
Solution Approach 1:
The coarse surfaces with uneven patterns are pre-formed on the fixing elements and protection plates before operation begins. This preliminary surface treatment creates a surface structure that can accommodate deposition accumulation without peeling, allowing the components to withstand extended operation times and multiple deposition cycles before replacement is needed.
Solution Approach 2:
The coarse surface treatment is applied only to specific contact surfaces of the fixing elements and protection plates where deposition accumulation occurs, rather than the entire surface area. This localized approach extends the replacement cycle and improves utilization rate while minimizing the impact on overall surface area and deposition quality on the wafer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coarse surface design allows for more deposition accumulation without peeling, reducing the need for frequent cleaning and replacement, enhancing yield rate and quality while lowering operational costs.
Implementation Method 1
The coarse surface improves the surface area and coarseness of the surface. The increase of surface area improves the number of the depositions that the element can withstand and extends the use cycle of the component.
Implementation Method 2
Sputtering, or physical vapor deposition (PVD), is a deposition method to add layers of metal and related material during manufacturing semiconductor.
Implementation Method 3
Sputtering, or physical vapor deposition (PVD), is a deposition method to add layers of metal and related material during manufacturing semiconductor.
Data Source
AI summary
A structure of reaction chamber of semiconductor sputtering equipment is disclosed, including a chamber case, an elevation platform, a plurality of target fixing elements, a carrier ring and a covering protective ring, wherein the contact surface of the target fixing element, the ring-shaped protruding surface of the carrier ring and the attachment surface of the covering protective ring are all coarse surfaces with uneven patterns. As such, during sputtering, the contact surface, ring-shaped protruding surface and attachment surface can withstand the deposition thickening and extend the cycle of cleaning components and life span so as to improve utilization rate of the equipment and reduce the manufacturing cost.