Sputtering Collimator Adjustment for Magnet-Driven Particle Direction
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Solution Overview
Problem
Existing sputtering technologies face challenges in controlling the incident angle and directivity of target particles onto a substrate, leading to inefficient film formation and potential deposition at unplanned positions.
Innovation Solution
A sputtering apparatus with a magnet moving mechanism and collimator system, where magnets on the target adjust the plasma state and regulating plates between the target and substrate limit the incident angle of target particles, ensuring controlled directivity by adjusting their positions in tandem with the magnets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a collimator with fixed regulating plates is used to limit incident angle, then directivity of target particles is controlled, but the apparatus cannot adapt to magnet movement and film uniformity deteriorates
Solution Approach 1:
The regulating plates are made movable rather than fixed, allowing them to adjust their positions dynamically. The arrangement position adjustment mechanism enables the regulating plates to follow the magnet's movement, maintaining optimal incident angle control throughout the sputtering process and ensuring film uniformity despite magnet displacement.
2Manufacturing precision
If multiple shielding portions are added to control particle direction, then directivity is improved, but device complexity increases
Solution Approach 1:
The regulating plates serve multiple functions: they limit the incident angle of target particles, control particle directivity, and can be repositioned to adapt to magnet movement. This multi-functionality eliminates the need for separate shielding portions, achieving effective particle direction control without increasing device complexity.
3Productivity
If the magnet is moved to improve target utilization, then film formation efficiency increases, but incident angle control is lost
Solution Approach 1:
The arrangement position adjustment mechanism provides feedback control by continuously adjusting the regulating plates' positions in response to magnet movement. This ensures that the incident angle control is maintained throughout the magnet's travel range, allowing efficient target utilization without sacrificing film quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for precise control of target particle incidence, improving film uniformity and efficiency by limiting the incident angle and enhancing target utilization, while maintaining a simple apparatus design.
Implementation Method 1
a magnet, provided on a rear surface of the target when viewed from the substrate support side, for adjusting a state of the plasma on the surface of the target
Implementation Method 2
the collimator includes two regulating plates, disposed apart from each other and facing each other, for limiting an incident angle at which the target particles emitted from the target are incident on the substrate
Implementation Method 3
a target, having a surface disposed to face the substrate placed on the substrate support, for emitting target particles to be adhered to the substrate by plasma formed in the processing chamber
Data Source
AI summary
An apparatus for performing a sputtering process on a substrate is provided. The apparatus includes a processing chamber having a substrate support on which the substrate is placed, a target for emitting target particles to be adhered to the substrate by plasma formed in the processing chamber, a magnet, provided on a rear surface of the target, for adjusting a state of the plasma on the surface of the target, and a magnet moving mechanism for repeatedly moving the magnet between a position on one side and a position on the other side set across a center portion on the rear surface of the target. The apparatus further includes a collimator having two regulating plates for limiting an incident angle of the target particles to the substrate, and an arrangement position adjustment mechanism adjusting positions of the two regulating plates according to the movement of the magnet.